Patent Assignment
Reel/Frame 035483/0204
Assignment of Assignor's Interest
Recorded: 2015-04-23
Pages: 2
Assignors
HWANG, CHIEN LING
Executed: 2010-05-20
TSAI, HUI-JUNG
Executed: 2010-05-20
WU, YI-WEN
Executed: 2010-05-20
LIU, CHUNG-SHI
Executed: 2010-05-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Forming Cu Pillar Bump with Non-Metal Sidewall Spacer and Metal Top Cap