Patent Assignment
Reel/Frame 035484/0749
Assignment of Assignor's Interest
Recorded: 2015-04-23
Pages: 5
Assignors
MAO, JIANHONG
Executed: 2015-04-22
HAN, FENGQIN
Executed: 2015-04-22
WANG, ZHIWEI
Executed: 2015-04-22
CHANG, WENFEN
Executed: 2015-04-22
Assignee
SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD.
ROOM 501B, BUILDING #5, 3000 LONG DONG AVENUE, ZHANGJIANG HIGH TECH PARK, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Methods of Fabrication and Testing of Three-Dimensional Stacked Integrated Circuit System-In-Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 17, 2016
From: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD.
To: SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037758/0402 →
Assignment of Assignor's Interest
Aug 3, 2018
From: SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
To: NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
Reel/Frame 046554/0167 →