IP Library › Assignment 046554/0167
Patent Assignment
Reel/Frame 046554/0167

Assignment of Assignor's Interest

Recorded: 2018-08-03 Pages: 3
Assignor
Assignee
NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
BUILDING 3, BUILDING 4 AND BUILDING 5, 335 ANJU ROAD, XIAOGANG STREET, BEILUN DISTRICT, NINGBO, 315800, CHINA
Covered Properties (3)
Methods of Fabrication and Testing of Three-Dimensional Stacked Integrated Circuit System-In-Package
Patent: 9,570,429 →
Application: 14/694,868 →
Publication: US 2015/0311188
Film Bulk Acoustic Resonator and Method of Fabricating Same
Application: 15/390,050 →
Publication: US 2017/0207764
Rfic Device and Method of Fabricating Same
Application: 15/949,310 →
Publication: US 2018/0331010
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 23, 2015
From: MAO, JIANHONG; HAN, FENGQIN; WANG, ZHIWEI; CHANG, WENFEN
To: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 035484/0749 →
Assignment of Assignor's Interest Feb 17, 2016
From: SHANGHAI LEXVU OPTO MICROELECTRONICS TECHNOLOGY CO., LTD.
To: SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 037758/0402 →
Assignment of Assignor's Interest Jan 3, 2017
From: WANG, XIAOCHUAN
To: SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 040827/0764 →
Assignment of Assignor's Interest Apr 11, 2018
From: WANG, XIAOCHUAN
To: SHANGHAI JADIC OPTOELECTRONICS TECHNOLOGY CO., LTD
Reel/Frame 045910/0197 →