Patent Assignment
Reel/Frame 035498/0014
Assignment of Assignor's Interest
Recorded: 2015-04-27
Received: 2015-04-27
Pages: 4
Assignor
FUJITSU SEMICONDUCTOR LIMITED
Executed: 2015-03-30
Assignee
TRINITY SEMICONDUCTOR RESEARCH G.K.
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JPX, 211-8588, JAPAN
Covered Properties
(6)
Semiconductor Device Having Wirings Formed by Damascene
Application:
12/755,656 →
Semiconductor Device Having Wirings Formed by Damascene and Its Manufacture Method
Application:
11/515,202 →
Semiconductor Device, Semiconductor Substrate and Fabrication Process of a Semiconductor Device
Application:
11/350,840 →
Semiconductor Device, Semiconductor Substrate and Fabrication Process of a Semiconductor Device
Application:
11/001,313 →
Semiconductor Device
Application:
10/694,985 →
Semiconductor Device with Multilevel Wiring Layers
Application:
10/352,029 →