Patent Assignment
Reel/Frame 035516/0468
Assignment of Assignor's Interest
Recorded: 2015-04-28
Pages: 4
Assignors
MANN, PHILLIP V.
Executed: 2015-01-15
O'CONNELL, KEVIN M.
Executed: 2015-01-15
SINHA, ARVIND K.
Executed: 2015-01-15
STATHAKIS, KARL
Executed: 2015-01-15
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Implementing Integrated Circuit Chip Attach in Three Dimensional Stack Using Vapor Deposited Solder Cu Pillars
Patent:
9,299,591 →
Application:
14/698,224 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.