Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars

1. A method for implementing an interconnect for individual integrated circuit (IC) chip attach in a three dimensional (3D) stack comprising:

providing an interconnect for joining IC chips and providing holes for copper pillars in a carrier material;

forming said interconnect with a plurality of hollow copper pillars,

coating said hollow copper pillars with lead free solder using vapor deposition;

masking the carrier material to isolate copper plating and coating the holes with copper;

vapor depositing solder to the copper pillars;

aligning the IC chips with the carrier, and reflow soldering; and

vapor depositing an aluminum copper alloy to the reflow soldered copper pillars.