Patent Assignment
Reel/Frame 035540/0325
Assignment of Assignor's Interest
Recorded: 2015-04-30
Pages: 9
Assignors
KATKAR, RAJESH
Executed: 2015-04-29
VU, TU TAM
Executed: 2015-04-30
LEE, BONGSUB
Executed: 2015-04-29
BANG, KYONG-MO
Executed: 2015-04-29
LI, XUAN
Executed: 2015-04-29
HUYNH, LONG
Executed: 2015-04-30
GUEVARA, GABRIEL Z.
Executed: 2015-04-30
AGRAWAL, AKASH
Executed: 2015-04-29
SUBIDO, WILLMAR
Executed: 2015-04-29
MIRKARIMI, LAURA WILLS
Executed: 2015-04-29
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Wafer-Level Packaging Using Wire Bond Wires in Place of a Redistribution Layer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073508/0668 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073508/0751 →