IP Library › Assignment 035541/0001
Patent Assignment
Reel/Frame 035541/0001

Assignment of Assignor's Interest

Recorded: 2015-04-30 Pages: 6
Assignors
DIMITRAKOPOULOS, CHRISTOS D.
Executed: 2013-03-13
KIM, JEEHWAN
Executed: 2013-03-13
PARK, HONGSIK
Executed: 2013-03-15
SHIN, BYUNGHA
Executed: 2013-03-13
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Method of Forming High-Density Arrays of Nanostructures
Patent: 9,312,132 →
Application: 14/701,213 →
Publication: US 2015/0235849
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 11, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052620/0961 →