Patent Assignment
Reel/Frame 035551/0225
Assignment of Assignor's Interest
Recorded: 2015-04-29
Pages: 5
Assignors
LEE, CHIH-CHENG
Executed: 2015-04-23
SU, YUAN-CHANG
Executed: 2015-04-23
HO, CHENG-LIN
Executed: 2015-04-23
WU, CHUNG-MING
Executed: 2015-04-23
YEN, YOU-LUNG
Executed: 2015-04-23
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Substrate, Semiconductor Package Structure and Method of Making the Same