Patent Assignment
Reel/Frame 035590/0039
Assignment of Assignor's Interest
Recorded: 2015-05-07
Pages: 6
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus, and Recording Medium
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Sep 12, 2017
From: SCALE COMPUTING, INC.
To: BET ASSOCIATES III, LLC
Reel/Frame 043820/0802 →
Assignment of Assignor's Interest
Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →
Release of Security Interest
Mar 29, 2019
From: BET ASSOCIATES III, LLC
To: SCALE COMPUTING, INC.
Reel/Frame 048747/0302 →
Security Interest
Feb 3, 2023
From: SCALE COMPUTING, INC.
To: NORTH HAVEN EXPANSION CREDIT II LP
Reel/Frame 062586/0059 →
Security Interest
Oct 13, 2023
From: SCALE COMPUTING, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 065213/0109 →
Release of Security Interest
Jul 31, 2025
From: BANC OF CALIFORNIA (FORMERLY KNOWN AS PACIFIC WESTERN BANK)
To: SCALE COMPUTING, INC.
Reel/Frame 071898/0667 →
Release of Security Interest
Jul 31, 2025
From: MS PRIVATE CREDIT ADMINISTRATIVE SERVICES LLC AS AGENT
To: SCALE COMPUTING, INC.
Reel/Frame 071901/0365 →