IP Library Assignment 035597/0813
Patent Assignment
Reel/Frame 035597/0813

Assignment of Assignor's Interest

Recorded: 2015-05-08 Pages: 7
Assignors
KOEP, PAUL J.
Executed: 2014-07-03
DE MONCHY, MICHIEL A.
Executed: 2014-08-19
TORMEY, ELLEN S.
Executed: 2014-07-02
Assignee
ALPHA METALS, INC.
109 CORPORATE BLVD., SOUTH PLAINFIELD, NEW JERSEY, 07080
Covered Property (1)
Systems and Methods for Void Reduction in a Solder Joint
Application: 14/347,035 →
Publication: US 2014/0328039
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement Apr 15, 2016
From: ALPHA METALS, INC.
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 038439/0590 →
Release of Security Interest Feb 4, 2019
From: BARCLAYS BANK PLC, AS COLLATERAL AGENT
To: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
Reel/Frame 048232/0849 →
Security Interest Feb 5, 2019
From: ALPHA ASSEMBLY SOLUTIONS INC. (F/K/A ALPHA METALS, INC.)
To: BARCLAYS BANK PLC, AS COLLATERAL AGENT
Reel/Frame 048260/0683 →
Change of Name Feb 20, 2019
From: ALPHA METALS, INC.
To: ALPHA ASSEMBLY SOLUTIONS INC.
Reel/Frame 048389/0389 →
Assignment of Security Interest in Patent Collateral Nov 17, 2022
From: BARCLAYS BANK PLC
To: CITIBANK, N.A.
Reel/Frame 061956/0643 →