IP Library › Assignment 035621/0271
Patent Assignment
Reel/Frame 035621/0271

Assignment of Assignor's Interest

Recorded: 2015-05-12 Pages: 2
Assignor
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656, NETHERLANDS
Covered Property (1)
Method and System for Transferring Semiconductor Devices from a Wafer to a Carrier Structure
Application: 14/710,302 →
Publication: US 2016/0336207
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2017
From: NXP B.V.
To: NEXPERIA B.V.
Reel/Frame 041104/0062 →