Patent Assignment
Reel/Frame 035622/0732
Assignment of Assignor's Interest
Recorded: 2015-05-12
Pages: 20
Assignors
CHEN, PIN-HONG
Executed: 2015-05-06
LAI, KUO-CHIH
Executed: 2015-05-06
HSU, CHIA CHANG
Executed: 2015-05-06
CHIU, CHUN-CHIEH
Executed: 2015-05-06
CHEN, LI-HAN
Executed: 2015-05-06
HUANG, SHU MIN
Executed: 2015-05-06
TSAI, MIN-CHUAN
Executed: 2015-05-06
HUANG, HSIN-FU
Executed: 2015-05-06
HSU, CHI-MAO
Executed: 2015-05-06
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Structure and Process for Forming Plug Including Layer with Pulled Back Sidewall Part