Patent Assignment
Reel/Frame 035640/0471
Assignment of Assignor's Interest
Recorded: 2015-05-14
Pages: 3
Assignor
ZHU, HUILONG
Executed: 2015-05-14
Assignee
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
NO. 3 BEITUCHENG WEST ROAD, CHAOYANG DISTRICT, BEIJING, 100029, CHINA
Covered Property
(1)
3D Integrated Circuit Structure, Semiconductor Device and Method of Manufacturing Same