Patent Assignment
Reel/Frame 035671/0474
Assignment of Assignor's Interest
Recorded: 2015-05-19
Pages: 8
Assignors
LA TULIPE, DOUGLAS C., JR
Executed: 2013-09-03
LIN, WEI
Executed: 2013-09-03
SKORDAS, SPYRIDON
Executed: 2013-09-03
WINSTEL, KEVIN R
Executed: 2013-09-03
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Reducing Wafer Bonding Misalignment by Varying Thermal Treatment Prior to Bonding
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 3, 2015
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 036550/0001 →
Assignment of Assignor's Interest
Oct 5, 2015
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 036779/0001 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →