IP Library › Assignment 035677/0069
Patent Assignment
Reel/Frame 035677/0069

Assignment of Assignor's Interest

Recorded: 2015-05-20 Pages: 5
Assignors
GOTO, TAKAYUKI
Executed: 2015-05-12
TSUTSUMI, KEIICHIRO
Executed: 2015-05-12
TSUNO, TAKESHI
Executed: 2015-05-12
KINOUCHI, MASATO
Executed: 2015-05-12
IDE, KENSUKE
Executed: 2015-05-12
Assignee
MITSUBISHI HEAVY INDUSTRIES, LTD.
16-5, KONAN 2-CHOME, MINATO-KU, TOKYO, 108-8215, JAPAN
Covered Property (1)
Room-Temperature Bonded Device, Wafer Having Room-Temperature Bonded Device, and Room-Temperature Bonding Method
Application: 14/443,694 →
Publication: US 2015/0294900
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 31, 2016
From: MITSUBISHI HEAVY INDUSTRIES, LTD.
To: MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
Reel/Frame 038160/0423 →