Patent Assignment
Reel/Frame 038160/0423
Assignment of Assignor's Interest
Recorded: 2016-03-31
Pages: 4
Assignor
MITSUBISHI HEAVY INDUSTRIES, LTD.
Executed: 2016-03-28
Assignee
MITSUBISHI HEAVY INDUSTRIES MACHINE TOOL CO., LTD.
130, ROKUJIZO, RITTO-SHI, SHIGA, 520-3080, JAPAN
Covered Properties
(3)
Room-Temperature Bonding Apparatus
Room-Temperature Bonding Apparatus and Room-Temperature Bonding Method
Application:
14/426,606 →
Publication:
US 2015/0249026
Room-Temperature Bonded Device, Wafer Having Room-Temperature Bonded Device, and Room-Temperature Bonding Method
Application:
14/443,694 →
Publication:
US 2015/0294900
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 21, 2014
From: KINOUCHI, MASATO; GOTO, TAKAYUKI; TSUNO, TAKESHI; IDE, KENSUKE
To: MITSUBISHI HEAVY INDUSTRIES, LTD.
Reel/Frame 032500/0706 →
Assignment of Assignor's Interest
Mar 9, 2015
From: TSUNO, TAKESHI; GOTO, TAKAYUKI; KINOUCHI, MASATO; UTSUMI, JUN
To: MITSUBISHI HEAVY INDUSTRIES, LTD.
Reel/Frame 035118/0574 →
Assignment of Assignor's Interest
May 20, 2015
From: GOTO, TAKAYUKI; TSUTSUMI, KEIICHIRO; TSUNO, TAKESHI; KINOUCHI, MASATO
To: MITSUBISHI HEAVY INDUSTRIES, LTD.
Reel/Frame 035677/0069 →