Patent Assignment
Reel/Frame 035721/0587
Assignment of Assignor's Interest
Recorded: 2015-05-27
Pages: 14
Assignors
SATO, HIROAKI
Executed: 2012-03-09
KANG, TECK-GYU
Executed: 2012-05-01
HABA, BELGACEM
Executed: 2012-01-18
OSBORN, PHILIP R.
Executed: 2012-05-02
WANG, WEI-SHUN
Executed: 2012-03-13
CHAU, ELLIS
Executed: 2012-03-28
MOHAMMED, ILYAS
Executed: 2012-03-15
MASUDA, NORIHITO
Executed: 2012-05-05
SAKUMA, KAZUO
Executed: 2012-05-01
HASHIMOTO, KIYOAKI
Executed: 2012-04-30
INETARO, KUROSAWA
Executed: 2012-05-01
KIKUCHI, TOMOYUKI
Executed: 2012-05-02
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Certificate of Conversion & Change of Name
Jun 27, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060443/0792 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →