Patent Assignment
Reel/Frame 060443/0792
Certificate of Conversion & Change of Name
Recorded: 2022-06-27
Pages: 7
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(52)
High Density Three-Dimensional Integrated Capacitors
High Density Three-Dimensional Integrated Capacitors
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
High Density Three-Dimensional Integrated Capacitors
High Density Three-Dimensional Integrated Capacitors
Selective Removal of Semiconductor Fins
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Punch Through Stopper in Bulk Finfet Device
Structure and Process to Tuck Fin Tips Self-Aligned to Gates
Bulk Nanosheet with Dielectric Isolation
High Density Three-Dimensional Integrated Capacitors
Stable Work Function for Narrow-Pitch Devices
Patent:
9,583,486 →
Application:
14/946,245 →
Middle-Of-Line (Mol) Capacitance Reduction for Self-Aligned Contact in Gate Stack
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
High Density Three-Dimensional Integrated Capacitors
Semiconductor Structures Including Middle-of-Line (Mol) Capacitance Reduction for Self-Aligned Contact in Gate Stack
Punch Through Stopper in Bulk Finfet Device
Punch Through Stopper in Bulk Finfet Device
Self-Forming Barrier for Use in Air Gap Formation
Selective Gas Etching for Self-Aligned Pattern Transfer
Stable Work Function for Narrow-Pitch Devices
Stacked Transistors with Different Channel Widths
Patent:
9,660,028 →
Application:
15/339,665 →
Punch Through Stopper in Bulk Finfet Device
Nanosheet Field Effect Transistors with Partial Inside Spacers
Alternating Hardmasks for Tight-Pitch Line Formation
Selective Removal of Semiconductor Fins
Stacked Transistors with Different Channel Widths
Forming Self-Aligned Vias and Air-Gaps in Semiconductor Fabrication
Patent:
9,911,652 →
Application:
15/472,745 →
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Bulk Nanosheet with Dielectric Isolation
Bulk Nanosheet with Dielectric Isolation
Punch Through Stopper in Bulk Finfet Device
Punch Through Stopper in Bulk Finfet Device
Nanosheet Field Effect Transistors with Partial Inside Spacers
Alternating Hardmasks for Tight-Pitch Line Formation
Stable Work Function for Narrow-Pitch Devices
Forming Self-Aligned Vias and Air-Gaps in Semiconductor Fabrication
Selective Gas Etching for Self-Aligned Pattern Transfer
Punch Through Stopper in Bulk Finfet Device
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
High Density Three-dimensional Integrated Capacitors
Self-Forming Barrier for Use in Air Gap Formation
Forming Self-Aligned Vias and Air-Gaps in Semiconductor Fabrication
Middle-Of-Line (Mol) Capacitance Reduction for Self-Aligned Contact in Gate Stack
Semiconductor Structures Including Middle-of-Line (Mol) Capacitance Reduction for Self-Aligned Contact in Gate Stack
Alternating Hardmasks for Tight-Pitch Line Formation
Selective Gas Etching for Self-Aligned Pattern Transfer
Nanosheet Field Effect Transistors with Partial Inside Spacers
Package-On-Package Assembly with Wire Bonds to Encapsulation Surface
Selective Gas Etching for Self-Aligned Pattern Transfer
Punch Through Stopper in Bulk Finfet Device
Application:
61/980,292 →
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 12, 2013
From: OGANESIAN, VAGE; HABA, BELGACEM; MOHAMMED, ILYAS; SAVALIA, PIYUSH
To: TESSERA RESEARCH LLC
Reel/Frame 031096/0654 →
Assignment of Assignor's Interest
Aug 14, 2013
From: TESSERA RESEARCH LLC
To: TESSERA, INC.
Reel/Frame 031169/0620 →
Assignment of Assignor's Interest
Dec 22, 2014
From: BASKER, VEERARAGHAVAN S.; LIU, ZUOGUANG; YAMASHITA, TENKO; YEH, CHUN-CHEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 034567/0795 →
Assignment of Assignor's Interest
Jan 27, 2015
From: MOHAMMED, ILYAS; HABA, BELGACEM; UZOH, CYPRIAN; SAVALIA, PIYUSH
To: TESSERA, INC.
Reel/Frame 034825/0370 →
Assignment of Assignor's Interest
May 22, 2015
From: DORIS, BRUCE B.; HE, HONG; KANAKASABAPATHY, SIVANANDA K.; KARVE, GAURI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 035699/0303 →
Assignment of Assignor's Interest
May 27, 2015
From: SATO, HIROAKI; KANG, TECK-GYU; HABA, BELGACEM; OSBORN, PHILIP R.
To: TESSERA, INC.
Reel/Frame 035721/0587 →
Assignment of Assignor's Interest
Oct 21, 2015
From: CHENG, KANGGUO; DORIS, BRUCE B.; WANG, JUNLI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 036849/0593 →
Assignment of Assignor's Interest
Nov 17, 2015
From: MOHAMMED, ILYAS; HABA, BELGACEM; UZOH, CYPRIAN; SAVALIA, PIYUSH
To: TESSERA, INC.
Reel/Frame 037061/0420 →
Assignment of Assignor's Interest
Nov 19, 2015
From: ANDO, TAKASHI; BAJAJ, MOHIT; HOOK, TERENCE B.; PANDEY, RAJAN K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 037092/0027 →
Assignment of Assignor's Interest
Nov 24, 2015
From: OK, INJO; PRANATHARTHIHARAN, BALASUBRAMANIAN; SEO, SOON-CHEON; SURISETTY, CHARAN V.V.S.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 037136/0608 →
Assignment of Assignor's Interest
Jan 5, 2016
From: SATO, HIROAKI; KANG, TECK-GYU; HABA, BELGACEM; OSBORN, PHILIP R.
To: TESSERA, INC.
Reel/Frame 037410/0882 →
Assignment of Assignor's Interest
Jul 1, 2016
From: OGANESIAN, VAGE; HABA, BELGACEM; MOHAMMED, ILYAS; SAVALIA, PIYUSH
To: TESSERA RESEARCH LLC
Reel/Frame 039062/0355 →
Assignment of Assignor's Interest
Jul 5, 2016
From: TESSERA RESEARCH LLC
To: TESSERA, INC.
Reel/Frame 039074/0417 →
Assignment of Assignor's Interest
Jul 8, 2016
From: OK, INJO; PRANATHARTHIHARAN, BALASUBRAMANIAN; SEO, SOON-CHEON; SURISETTY, CHARAN V.V.S.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039112/0796 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Sep 13, 2023
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 064897/0184 →
Change of Name
Jun 14, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 067737/0757 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →