High density three-dimensional integrated capacitors
A component includes a substrate and a capacitor formed in contact with the substrate. The substrate can consist essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C. The substrate can have a surface and an opening extending downwardly therefrom. The capacitor can include at least first and second pairs of electrically conductive plates and first and second electrodes. The first and second pairs of plates can be connectable with respective first and second electric potentials. The first and second pairs of plates can extend along an inner surface of the opening, each of the plates being separated from at least one adjacent plate by a dielectric layer. The first and second electrodes can be exposed at the surface of the substrate and can be coupled to the respective first and second pairs of plates.
1. A component having electrodes for electrical interconnection with a circuit component or microelectronic element, comprising:
a substrate consisting essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C., the substrate having a first surface, a second surface opposite the first surface, and an opening in the first surface having at least one dimension greater than 5 microns in a direction along the first surface, the opening extending downwardly from the first surface; and
a capacitor, including:
first and second electrically conductive plates connectable with respective first and second electric potentials, the first and second plates extending along an inner surface of the opening, the first and second plates being separated from one another by a dielectric layer, the first plate being grounded to the substrate; and
first and second electrodes, the first electrode exposed at the first surface and electrically connected to the first plate, the second electrode exposed at one of the first and second surfaces and electrically connected to the second plate,
wherein the first and second electrodes are connected to the first and second plates at respective first and second locations, the second electrode being exposed at the first surface, the capacitor further including third and fourth electrodes connected to the first and second plates at respective third and fourth locations.
2. The component as claimed in claim 1 , wherein the first plate has a long dimension extending between the first and third locations, and the second plate has a long dimension extending between the second and fourth locations.
3. The component as claimed in claim 1 , wherein the substrate has a second surface opposite the first surface and the opening extends only partially through a thickness of the substrate from the first surface towards the second surface.
4. The component as claimed in claim 3 , wherein the first opening has a frustoconical shape, the inner surface of the opening extending at an angle of less than 80 degrees relative to the substrate first surface.
5. The component as claimed in claim 3 , wherein the opening has a depth in a direction perpendicular to the first surface of at least 10 microns.
6. The component as claimed in claim 1 , wherein the opening extends between the first and second surfaces through a thickness of the substrate.
7. The component as claimed in claim 6 , wherein the first and second plates extend between the first and second surfaces through the opening.
8. The component as claimed in claim 7 , wherein the capacitor is a first capacitor, and the first and second plates of the first capacitor and first and second plates of a second capacitor extend between the first and second surfaces through the opening, the first and second capacitors being insulated from one another within the opening.
9. The component as claimed in claim 8 , wherein the first and second plates of each capacitor do not extend above the first surface or below the second surface, the second electrode being exposed at the second surface.
10. A component having electrodes for electrical interconnection with a circuit component or microelectronic element, comprising:
a substrate consisting essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C., the substrate having a first surface, a second surface opposite the first surface, and an opening in the first surface having at least one dimension greater than 5 microns in a direction along the first surface, the opening extending downwardly from the first surface; and
a capacitor, including:
first and second electrically conductive plates connectable with respective first and second electric potentials, the first and second plates extending along an inner surface of the opening, the first and second plates being separated from one another by a dielectric layer, the first plate being grounded to the substrate; and
first and second electrodes, the first electrode exposed at the first surface and electrically connected to the first plate, the second electrode exposed at one of the first and second surfaces and electrically connected to the second plate,
wherein the opening extends between the first and second surfaces through a thickness of the substrate, the first and second plates extend between the first and second surfaces through the opening, and the capacitor further includes third and fourth electrodes exposed at the second surface and respectively coupled to the first and second plates, the second electrode being exposed at the first surface.