IP Library › Assignment 064897/0184
Patent Assignment
Reel/Frame 064897/0184

Change of Name

Recorded: 2023-09-13 Pages: 5
Assignor
TESSERA LLC
Executed: 2022-08-15
Assignee
ADEIA SEMICONDUCTOR SOLUTIONS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (5)
High Density Three-Dimensional Integrated Capacitors
Patent: 8,502,340 →
Application: 12/964,049 →
Publication: US 2012/0146182
High Density Three-Dimensional Integrated Capacitors
Patent: 9,431,475 →
Application: 13/954,455 →
Publication: US 2013/0313680
High Density Three-Dimensional Integrated Capacitors
Application: 15/198,524 →
Publication: US 2016/0315139
High Density Three-dimensional Integrated Capacitors
Application: 16/219,225 →
Publication: US 2019/0131387
High Density Three-dimensional Integrated Capacitors
Application: 17/316,102 →
Publication: US 2021/0265460
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 15, 2022
From: TESSERA RESEARCH LLC
To: TESSERA, INC.
Reel/Frame 060208/0618 →
Certificate of Conversion & Change of Name Jun 15, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060449/0357 →
Certificate of Conversion & Change of Name Jun 27, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060443/0792 →
Security Interest May 19, 2023
From: ADEIA GUIDES INC.; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.; ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063707/0884 →