IP Library Granted Patent US 9,876,074
Granted Patent B2
US 9,876,074 · App. 14/719,829 · Granted Jan 23, 2018

Structure and process to tuck fin tips self-aligned to gates

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,876,074
App. No.
14/719,829
Granted
Jan 23, 2018
Kind
B2
Abstract

A semiconductor structure is provided that includes a semiconductor fin portion having an end wall and extending upward from a substrate. A gate structure straddles a portion of the semiconductor fin portion. A first set of gate spacers is located on opposing sidewall surfaces of the gate structure; and a second set of gate spacers is located on sidewalls of the first set of gate spacers. One gate spacer of the second set of gate spacers has a lower portion that directly contacts the end wall of the semiconductor fin portion.

Claims (16)

1. A semiconductor structure comprising:

a semiconductor fin portion having an end wall and extending upwards from a substrate;

a gate structure straddling a portion of said semiconductor fin portion;

a first set of gate spacers located on opposing sidewall surfaces of said gate structure; and

a second set of gate spacers located on outer sidewalls of said first gate spacers, wherein one gate spacer of said second set of gate spacers has an inner sidewall surface having an upper portion directly contacting said outer sidewall of one of said gate spacers of said first set of gate spacers and a lower portion directly contacting and covering an entirety of a sidewall of said end wall of said semiconductor fin portion.

2. The semiconductor structure of claim 1 , wherein said gate structure is a functional gate structure.

3. The semiconductor structure of claim 2 , wherein each gate spacer of said first set of gate spacers is only located on a topmost surface of said semiconductor fin portion, and wherein one gate spacer of said first set of gate spacers has an outer edge that is vertically aligned to said sidewall of said end wall of said semiconductor fin portion.

4. The semiconductor structure of claim 3 , wherein another gate spacer of said second set of gate spacers straddles over said topmost surface of said semiconductor fin portion.

5. The semiconductor structure of claim 2 , wherein each gate spacer of said first set of gate spacers straddles over said semiconductor fin portion.

6. The semiconductor structure of claim 5 , wherein another gate spacer of said second set of gate spacers straddles another portion of said semiconductor fin portion.

7. The semiconductor structure of claim 1 , wherein said substrate is an insulator layer.

8. The semiconductor structure of claim 1 , wherein said first set of gate spacers comprises a same dielectric material as said second set of gate spacers.

9. The semiconductor structure of claim 1 , wherein said first set of gate spacers comprise a different dielectric material than said second set of gate spacers.

10. The semiconductor structure of claim 1 , wherein at least one gate spacer of said first set of gate spacers or said second set of gate spacers is composed of a SiBCN or SiOCN material.

11. The semiconductor structure of claim 1 , wherein one gate spacer of said first set of gate spacers has an outer surface that is vertically aligned with said sidewall surface of said end wall of said semiconductor fin portion.

12. The semiconductor structure of claim 1 , wherein a bottommost surface of each gate spacer of said second set of gate spacers is coplanar with a bottommost surface of said semiconductor fin portion.

Assignments (4)
CHANGE OF NAME Recorded Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →
CERTIFICATE OF CONVERSION & CHANGE OF NAME Recorded Jun 27, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060443/0792 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →