Nanosheet field effect transistors with partial inside spacers
A method of forming a nanosheet device, including forming a channel stack on a substrate, where the channel stack includes at least one nanosheet channel layer and at least one sacrificial release layer, forming a stack cover layer on at least a portion of the channel stack, forming a dummy gate on at least a portion of the stack cover layer, wherein at least a portion of the at least one nanosheet channel layer and at least one sacrificial release layer is exposed on opposite sides of the dummy gate, removing at least a portion of the at least one sacrificial release layer on each side of the dummy gate to form a sacrificial supporting rib, and forming an inner spacer layer on exposed portions of the at least one nanosheet channel layer and at least one sacrificial supporting rib.
1. A nanosheet device comprising:
a patterned channel stack disposed over a substrate comprising a first contiguous channel formed from a bottommost nanosheet channel layer;
a gate structure disposed over the patterned channel stack, the gate structure extending in a first direction parallel to the substrate;
a first and a second source/drain regions disposed on opposite sides of the gate structure in a second direction, the second direction being (i) parallel to the substrate and (ii) orthogonal to the first direction;
a first cavity fill;
a second cavity fill;
a third cavity fill; and
a fourth cavity fill,
wherein the first, second, third, and fourth cavity fills are (i) non-contiguous and (ii) each disposed under and contacting respective first, second, third, and fourth corners of the first contiguous channel.
2. The nanosheet device of claim 1 , wherein the gate structure includes a gate dielectric layer wrapped around a portion of the first contiguous channel and on a surface of each of the first, second, third, and fourth cavity fills.
3. The nanosheet device of claim 2 , wherein the gate structure includes a work function layer disposed on the gate dielectric layer wrapped around the portion of the first contiguous channel.
4. The nanosheet device of claim 1 , wherein the first contiguous channel is silicon.
5. The nanosheet device of claim 1 , wherein the first and second cavity fills contact the first source/drain region, and the third and fourth cavity fills contact the second source/drain region.
6. The nanosheet device of claim 1 , wherein each of the first, second, third, and fourth cavity fills are adjacent a portion of the gate structure underlying the first contiguous channel.
7. The nanosheet device of claim 1 , further comprising an interlayer dielectric on the first and second source/drain regions.
8. The nanosheet device of claim 1 , further comprising:
a second contiguous channel within the patterned channel stack;
a fifth cavity fill;
a sixth cavity fill;
a seventh cavity fill; and
an eighth cavity fill,
wherein the fifth, sixth, seventh, and eighth cavity fills are (i) non-contiguous and (ii) each disposed between and contacting the first and second contiguous channels at respective first, second, third, and fourth corners of the first and second contiguous channels.
9. The nanosheet device of claim 8 , wherein the eight cavity fills comprise a low-K oxide.
10. A nanosheet device comprising:
a patterned channel stack disposed over a substrate comprising (i) a first contiguous channel formed from a first nanosheet channel layer and (ii) a second contiguous channel formed from a second nanosheet channel layer, wherein the first contiguous channel is above and adjacent to the second contiguous channel;
a gate structure disposed over the patterned channel stack, the gate structure extending in a first direction parallel to the substrate;
a first and a second source/drain regions disposed on opposite sides of the gate structure in a second direction, the second direction being (i) parallel to the substrate and (ii) orthogonal to the first direction;
a first cavity fill;
a second cavity fill;
a third cavity fill; and
a fourth cavity fill,
wherein the first, second, third, and fourth cavity fills are (i) non-contiguous, (ii) each disposed under and contacting respective first, second, third, and fourth corners of the first contiguous channel, and (iii) each disposed over and contacting respective first, second, third, and fourth corners of the second contiguous channel.
11. The nanosheet device of claim 10 , wherein the first and second contiguous channels each have a thickness in a range of about 2 nm to about 10 nm.
12. The nanosheet device of claim 10 , wherein the first and second contiguous channels each have a thickness in a range of about 3 nm to about 7 nm.
13. The nanosheet device of claim 10 , wherein the first and second contiguous channels are silicon (Si).
14. The nanosheet device of claim 10 , wherein the first, second, third, and fourth cavity fills each have a thickness in a range of about 5 nm to about 20 nm.
15. The nanosheet device of claim 10 , wherein the first, second, third, and fourth cavity fills each have a thickness in a range of about 10 nm to about 15 nm.
16. The nanosheet device of claim 10 , wherein the first and second cavity fills contact the first source/drain region, and the third and fourth cavity fills contact the second source/drain region.
17. The nanosheet device of claim 10 , wherein the gate structure includes a work function layer disposed on a first gate dielectric layer wrapped around a portion of the first contiguous channel and on a second gate dielectric layer wrapped around a portion of the second contiguous channel.
18. The nanosheet device of claim 17 , wherein the work function layer fills a space between opposing first and second gate dielectric layers.
19. The nanosheet device of claim 17 , wherein the work function layer has a thickness in a range of about 1 nm to about 11 nm.
20. The nanosheet device of claim 17 , wherein the work function layer has a thickness in a range of about 1 nm to about 5 nm.