IP Library Granted Patent US 10,410,875
Granted Patent B2
US 10,410,875 · App. 15/802,634 · Granted Sep 10, 2019

Alternating hardmasks for tight-pitch line formation

Inventors: Sean D. Burns (Hopewell Junction, NY); Nelson M. Felix (Briarcliff Manor, NY); Chi-Chun Liu (Altamont, NY); Yann A. M. Mignot (Slingerlands, NY); Stuart A. Sieg (Albany, NY)
Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
H01L21/3088H01L21/0337H01L21/3065H01L21/3081H01L21/3085H01L21/3086H01L21/823431H01L29/66795
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Quick Facts
Patent No.
US 10,410,875
App. No.
15/802,634
Granted
Sep 10, 2019
Kind
B2
Abstract

A method for forming fins includes forming a three-color hardmask fin pattern on a fin base layer. The three-color hardmask fin pattern has hardmask fins of three mutually selectively etchable compositions. A region on the three-color hardmask fin pattern is masked, leaving one or more fins of a first color exposed. All exposed fins of the first color are etched away with a selective etch that does not remove fins of a second color or a third color. The mask and all fins of a second color are etched away. Fins are etched into the fin base layer by anisotropically etching around remaining fins of the first color and fins of the third color.

Claims (48)

1. A method for forming fins, comprising:

forming a three-color hardmask fin pattern on a fin base layer, the three-color hardmask fin pattern comprising hardmask fins of three mutually selectively etchable compositions;

masking a region on the three-color hardmask fin pattern, leaving one or more fins of a first color exposed;

etching away all exposed fins of the first color with a selective etch that does not remove fins of a second color or a third color;

etching away the mask and all fins of a second color;

etching fins into the fin base layer by anisotropically etching around remaining fins of the first color and fins of the third color.

2. The method of claim 1 , wherein forming the three-color hardmask fin pattern comprises:

forming fins of the first color on the fin base layer;

depositing a second-color material around the fins of the first color;

etching away fins of the first color, leaving gaps; and

forming fins of a third color in the gaps.

3. The method of claim 2 , wherein forming fins of the first color comprises:

forming self-assembled fins on a seed layer, the self-assembled fins comprising fins of alternating polymer materials;

etching away every other self-assembled fin; and

etching down into a layer of first-color material around the remaining self-assembled fins to form fins of a first color, leaving remaining fins having differing heights.

4. The method of claim 3 , wherein the fins of the first color each comprise a cap of one or more dielectric layers, with different dielectric layers corresponding to different heights of the fins of the first color.

5. The method of claim 3 , wherein forming self-assembled fins comprises applying a block copolymer material having two molecular chains of similar or equal length, wherein one of the two molecular chains is attracted to the seed layer.

6. The method of claim 5 , wherein a first chain of the material comprises polystyrene and wherein a second chain of the material comprises poly(methyl methacrylate).

7. The method of claim 3 , further comprising etching the second-color material to a height lower than a height of the tallest remaining self-assembled fins and greater than a height of the shortest remaining self-assembled fins.

8. The method of claim 3 , wherein etching away fins of the first color comprises etching away the fins of the first color having a greater-than-average height.

9. The method of claim 1 , wherein masking the region comprises forming a mask with a lithographic process having a minimum pitch size that is greater than a fin pitch of the three-color hardmask fin pattern.

10. The method of claim 1 , further comprising:

masking a region on the three-color hardmask fin pattern, leaving one or more fins of the third color exposed; and

etching away all exposed fins of the third color with a selective etch that does not remove fins of the first color or the second color.

11. A method of forming a three-color hardmask fin pattern, comprising:

forming fins of a first color on a fin base layer;

depositing a second-color material around the fins of the first color;

etching away fins of the first color, leaving gaps, wherein the etch further leaves at least one fin of the first color remaining; and

forming fins of a third color in the gaps.

12. The method of claim 11 , wherein forming fins of the first color comprises:

forming self-assembled fins on a seed layer, the self-assembled fins comprising fins of alternating base materials;

etching away every other self-assembled fin, leaving remaining self-assembled fins having differing heights; and

etching down into a layer of first-color material around the remaining self-assembled fins to form fins of a first color.

13. The method of claim 12 , wherein the fins of the first color each comprise a cap of one or more dielectric layers, with different dielectric layers corresponding to different heights of the fins of the first color.

14. The method of claim 12 , wherein forming self-assembled fins comprises applying a material having two molecular chains of similar or equal length, wherein one of the two molecular chains is attracted to the seed layer.

15. The method of claim 14 , wherein a first chain of the material comprises polystyrene and wherein a second chain of the material comprises poly(methyl methacrylate).

16. The method of claim 12 , further comprising etching the second-color material to a height lower than a height of the tallest remaining self-assembled fins and greater than a height of the shortest remaining self-assembled fins.

17. The method of claim 12 , wherein etching away fins of the first color comprises etching away the fins of the first color having a greater-than-average height.

18. A method of forming a three-color hardmask fin pattern, comprising:

forming fins of a first color on a fin base layer, by:

forming self-assembled fins on a seed layer, the self-assembled fins comprising fins of alternating base materials;

etching away every other self-assembled fin, leaving remaining self-assembled fins having differing heights; and

etching down into a layer of first-color material around the remaining self-assembled fins to form fins of a first color;

depositing a second-color material around the fins of the first color;

etching away fins of the first color, leaving gaps; and

forming fins of a third color in the gaps.

19. The method of claim 18 , further comprising etching the second-color material to a height lower than a height of the tallest remaining self-assembled fins and greater than a height of the shortest remaining self-assembled fins.

20. The method of claim 18 , wherein etching away fins of the first color comprises etching away the fins of the first color having a greater-than-average height.

Assignments (5)
CHANGE OF NAME Recorded Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0410 →
CERTIFICATE OF CONVERSION & CHANGE OF NAME Recorded Jun 27, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060443/0792 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 7, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051493/0546 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2017
From: BURNS, SEAN D.; FELIX, NELSON M.; LIU, CHI-CHUN; MIGNOT, YANN A.M.; SIEG, STUART A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044026/0664 →
Continuity (2)
Continuation 15445112 · Feb 28, 2017
Related Publication 20180247825A1 · Aug 30, 2018
Cited By (1)
US 12,322,601