Patent Assignment
Reel/Frame 051493/0546
Assignment of Assignor's Interest
Recorded: 2020-01-07
Pages: 16
Assignor
INTERNATIONAL BUSINESS MACHINES CORPORATION
Executed: 2019-12-27
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(55)
High-K/Metal Gate Mosfet with Reduced Parasitic Capacitance
3D Integration Structure and Method Using Bonded Metal Planes
High-K/Metal Gate Mosfet with Reduced Parasitic Capacitance
Method and Structure for Forming Dielectric Isolated Finfet with Improved Source/Drain Epitaxy
Patent:
9,601,514 →
Application:
15/006,284 →
Methods of Fabricating Semiconductor Fins by Double Sidewall Image Transfer Patterning Through Localized Oxidation Enhancement of Sacrificial Mandrel Sidewalls
Vertical Field Effect Transistors with Metallic Source/Drain Regions
Patent:
9,728,466 →
Application:
15/140,763 →
Selective Recessing to Form a Fully Aligned Via
Self-Forming Barrier for Use in Air Gap Formation
Method and Structure for Forming Dielectric Isolated Finfet with Improved Source/Drain Epitaxy
Fabrication of Nano-Sheet Transistors with Different Threshold Voltages
Patent:
9,653,289 →
Application:
15/268,993 →
Multiple Finfet Formation with Epitaxy Separation
Patent:
9,748,245 →
Application:
15/274,269 →
Forming a Sacrificial Liner for Dual Channel Devices
Patent:
9,773,893 →
Application:
15/276,029 →
Selective Gas Etching for Self-Aligned Pattern Transfer
Preserving Channel Strain in Fin Cuts
Approach to Minimization of Strain Loss in Strained Fin Field Effect Transistors
Patent:
9,818,875 →
Application:
15/295,546 →
Stacked Complementary Fets Featuring Vertically Stacked Horizontal Nanowires
Patent:
9,837,414 →
Application:
15/338,515 →
Inner Spacer for Nanosheet Transistors
Patent:
9,923,055 →
Application:
15/339,283 →
Forming a Sacrificial Liner for Dual Channel Devices
Hybrid-Channel Nano-Sheet Fets
Patent:
9,972,542 →
Application:
15/398,232 →
Nanosheet Transistors Having Different Gate Dielectric Thicknesses on the Same Chip
Patent:
9,935,014 →
Application:
15/404,469 →
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Patent:
9,935,195 →
Application:
15/404,904 →
Nanosheet Field Effect Transistors with Partial Inside Spacers
Vertical Field Effect Transistors with Metallic Source/Drain Regions
Approach to Minimization of Strain Loss in Strained Fin Field Effect Transistors
Alternating Hardmasks for Tight-Pitch Line Formation
Finfet with Uniform Shallow Trench Isolation Recess
Patent:
9,865,598 →
Application:
15/450,725 →
Fabrication of Nano-Sheet Transistors with Different Threshold Voltages
Nano-Sheet Transistors with Different Threshold Voltages
Efficient Metal-Insulator-Metal Capacitor
Alternating Hardmasks for Tight-Pitch Line Formation
Method and Structure for Forming Dielectric Isolated Finfet with Improved Source/Drain Epitaxy
Forming Self-Aligned Vias and Air-Gaps in Semiconductor Fabrication
Patent:
9,911,652 →
Application:
15/472,745 →
Sacrificial Mandrel Structure with Oxide Pillars having Different Widths and Resulting Fins Arrangements
SEMICONDUCTOR DEVICE FORMED BY WET ETCH REMOVAL OF Ru SELECTIVE TO OTHER METALS
Patent:
10,090,247 →
Application:
15/585,704 →
Multiple Finfet Formation with Epitaxy Separation
Self-Aligned Air Gap Spacer for Nanosheet Cmos Devices
Patent:
9,954,058 →
Application:
15/620,437 →
Integrating and Isolating Nfet and Pfet Nanosheet Transistors on a Substrate
Patent:
10,074,575 →
Application:
15/629,306 →
Sidewall Image Transfer (SIT) Methods with Localized Oxidation Enhancement of Sacrificial Mandrel Sidewall by Ion Beam Exposure
Forming a Sacrificial Liner for Dual Channel Devices
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Approach to Minimization of Strain Loss in Strained Fin Field Effect Transistors
Hybrid-Channel Nano-Sheet Fets
Alternating Hardmasks for Tight-Pitch Line Formation
Efficient Metal-Insulator-Metal Capacitor Fabrication
Wet Etch Removal of Ru Selective to Other Metals
Self-Aligned Air Gap Spacer for Nanosheet Cmos Devices
Forming Self-Aligned Vias and Air-Gaps in Semiconductor Fabrication
Finfet with Uniform Shallow Trench Isolation Recess
Inner Spacer for Nanosheet Transistors
Nanosheet Transistors Having Different Gate Dielectric Thicknesses on the Same Chip
Nanosheet Transistors Having Different Gate Dielectric Thicknesses on the Same Chip
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Hybrid-Channel Nano-Sheet Fets
Integrating and Isolating Nfet and Pfet Nanosheet Transistors on a Substrate
Preserving Channel Strain in Fin Cuts
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 26, 2016
From: CHENG, KANGGUO; LI, JUNTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 037582/0352 →
Assignment of Assignor's Interest
Mar 22, 2016
From: CHENG, KANGGUO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038072/0185 →
Assignment of Assignor's Interest
Apr 28, 2016
From: MALLELA, HARI V.; ROBISON, ROBERT R.; VEGA, REINALDO; VENIGALLA, RAJASEKHAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038403/0750 →
Assignment of Assignor's Interest
Aug 5, 2016
From: BRIGGS, BENJAMIN D.; DECHENE, JESSICA; HUANG, ELBERT E.; LEE, JOE
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039354/0842 →
Assignment of Assignor's Interest
Aug 30, 2016
From: BRIGGS, BENJAMIN D.; HUANG, ELBERT; NOGAMI, TAKESHI; PENNY, CHRISTOPHER J.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039588/0630 →
Assignment of Assignor's Interest
Sep 1, 2016
From: CHENG, KANGGUO; LI, JUNTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039616/0372 →
Assignment of Assignor's Interest
Sep 19, 2016
From: BALAKRISHNAN, KARTHIK; CHENG, KANGGUO; HASHEMI, POUYA; REZNICEK, ALEXANDER
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039780/0272 →
Assignment of Assignor's Interest
Sep 23, 2016
From: CHENG, KANGGUO; LI, JUNTAO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039845/0219 →
Assignment of Assignor's Interest
Sep 26, 2016
From: BU, HUIMING; CHENG, KANGGUO; GUO, DECHAO; KANAKASABAPATHY, SIVANANDA K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039857/0811 →
Assignment of Assignor's Interest
Oct 4, 2016
From: ARNOLD, JOHN CHRISTOPHER; BURNS, SEAN D.; MIGNOT, YANN ALAIN MARCEL; XU, YONGAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039932/0807 →
Assignment of Assignor's Interest
Oct 17, 2016
From: BI, ZHENXING; CHENG, KANGGUO; LI, JUNTAO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040033/0960 →
Assignment of Assignor's Interest
Oct 17, 2016
From: GREENE, ANDREW M.; GUO, DECHAO; RAMACHANDRAN, RAVIKUMAR; VENIGALLA, RAJASEKHAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040029/0335 →
Assignment of Assignor's Interest
Oct 31, 2016
From: CHENG, KANGGUO; XIE, RUILONG; YAMASHITA, TENKO; YEH, CHUN-CHEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040177/0647 →
Assignment of Assignor's Interest
Oct 31, 2016
From: BALAKRISHNAN, KARTHIK; CHENG, KANGGUO; HASHEMI, POUYA; REZNICEK, ALEXANDER
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040171/0826 →
Assignment of Assignor's Interest
Dec 30, 2016
From: BU, HUIMING; CHENG, KANGGUO; GUO, DECHAO; KANAKASABAPATHY, SIVANANDA K.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040811/0158 →
Assignment of Assignor's Interest
Jan 4, 2017
From: BI, ZHENXING; CHENG, KANGGUO; XU, PENG; XU, WENYU
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040842/0033 →
Assignment of Assignor's Interest
Jan 12, 2017
From: CHENG, KANGGUO; LI, JUNTAO; WANG, GENG; ZHANG, QINTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040964/0071 →
Assignment of Assignor's Interest
Jul 18, 2018
From: GREENE, ANDREW M.; GUO, DECHAO; RAMACHANDRAN, RAVIKUMAR; VENIGALLA, RAJASEKHAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 046384/0538 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Mar 24, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059498/0010 →
Change of Name
Apr 29, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059835/0051 →
Certificate of Conversion & Change of Name
Jun 27, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060443/0792 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 061388/0199 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0448 →
Change of Name
Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →