Forming a sacrificial liner for dual channel devices
Semiconductor devices and methods of forming the same include forming a liner over one or more channel fins on a substrate. An etch is performed down into the substrate using the one or more channel fins and the liner as a mask to form a substrate fin underneath each of the one or more channel fins. An area around the one or more channel fins and substrate fins is filled with a flowable dielectric. The flowable dielectric is annealed to solidify the flowable dielectric. The anneal oxidizes at least a portion of sidewalls of each substrate fin, such that each substrate fin is narrower in the oxidized portion than in a portion covered by the liner.
1. A method of forming a semiconductor device, comprising:
forming fins on a substrate, the fins having a base portion and a top channel portion which includes a liner;
filling an area around the fins with a flowable dielectric;
annealing the flowable dielectric to solidify the flowable dielectric, wherein the anneal oxidizes sidewalls of the base portion of each fin, such that each fin is narrower in the base portion than in the top channel portion; and
etching away the liner to expose the fins and to open gaps that are below a top surface of the solidified dielectric and between sidewalls of the solidified dielectric and sidewalls of respective adjacent fins.
2. The method of claim 1 , further comprising forming a plurality of said fins from two distinct channel materials.
3. The method of claim 2 , wherein a first distinct channel material is silicon and wherein a second distinct channel material is silicon germanium.
4. The method of claim 1 , further comprising recessing the solidified dielectric to a level below a top level of the liner and above a bottom level of the liner.
5. The method of claim 1 , further comprising:
depositing a gate dielectric layer over the fins and in the gaps; and
depositing a gate over the gate dielectric layer.
6. The method of claim 1 , wherein the liner is formed from silicon nitride.
7. The method of claim 1 , further comprising forming the fins with an etch that partially etches the substrate.
8. A method of forming a semiconductor device, comprising:
forming fins on a substrate, the fins having a base portion and a top channel portion which includes a liner;
filling an area around the fins with a flowable dielectric;
annealing the flowable dielectric to solidify the flowable dielectric, wherein the anneal oxidizes sidewalls of the base portion of each fin, such that each fin is narrower in the base portion than in the top channel portion; and
recessing the solidified dielectric to a level below a top level of the liner and above a bottom level of the liner.
9. The method of claim 8 , further comprising forming a plurality of said fins from two distinct channel materials.
10. The method of claim 9 , wherein a first distinct channel material is silicon and wherein a second distinct channel material is silicon germanium.
11. The method of claim 8 , further comprising etching away the liner to expose the fins and gaps at sidewalls of the one or more channel fins.
12. The method of claim 11 , further comprising:
depositing a gate dielectric layer over the fins and in the gaps; and
depositing a gate over the gate dielectric layer.
13. The method of claim 8 , wherein the liner is formed from silicon nitride.
14. The method of claim 8 , further comprising forming the fins with an etch that partially etches the substrate.