Nanosheet transistors having different gate dielectric thicknesses on the same chip
Embodiments are directed to a method and resulting structures for forming thin and thick gate dielectric nanosheet transistors on the same chip. A first nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on a substrate. A second nanosheet stack having a first sacrificial layer between a first nanosheet and a second nanosheet is formed on the substrate. The first nanosheet of the first nanosheet stack is doped and concurrently removed with the first sacrificial layer of the first nanosheet stack and the first sacrificial layer of the second nanosheet stack.
1. A method for forming a semiconductor device, the method comprising:
forming a first sacrificial layer between a first nanosheet and a second nanosheet;
forming a second sacrificial layer between a third nanosheet and a fourth nanosheet;
doping the first nanosheet;
forming another nanosheet over of the first nanosheet having been doped and the second nanosheet, subsequent to doping the first nanosheet;
wherein the first, second, another nanosheets are vertically stacked nanosheets in a first nanosheet stack and the third and fourth nanosheets are vertically stacked nanosheets in a second nanosheet stack;
concurrently removing the first sacrificial layer, the first nanosheet, and the second sacrificial layer, such that the first nanosheet is no longer present.
2. The method of claim 1 further comprising forming a dielectric layer over a channel region of the first and second nanosheets.
3. The method of claim 2 further comprising forming a first gate over the dielectric layer.
4. The method of claim 3 further comprising forming a first gate contact on the first gate.
5. The method of claim 3 further comprising forming a second gate over a channel region of the third and fourth nanosheets.
6. The method of claim 5 further comprising forming a second gate contact on the second gate.
7. The method of claim 1 , wherein each of the nanosheets in the first and second nanosheet stacks is separated by a sacrificial layer.
8. The method of claim 1 , wherein each of the nanosheets in the first and second nanosheet stacks comprises a thickness of about 4 nm to about 10 nm.
9. The method of claim 4 , wherein a thickness of the first sacrificial layer is at least twice a thickness of the second sacrificial layer.
10. The method of claim 1 , wherein the first and second nanosheet stacks are concurrently formed by removing portions of a semiconductor layer.
11. The method of claim 1 , wherein the nanosheets comprise silicon and the sacrificial layers comprise silicon germanium.
12. The method of claim 1 , wherein doping the first nanosheet comprises plasma doping the first nanosheet with a germanium dopant at a temperature of about 400 degrees Celsius to about 700 degrees Celsius.