Patent Assignment
Reel/Frame 073658/0771
Change of Name
Recorded: 2025-11-21
Pages: 8
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(79)
Forming Gates with Varying Length Using Sidewall Image Transfer
Vertical Field Effect Transistors with Metallic Source/Drain Regions
Patent:
9,728,466 →
Application:
15/140,763 →
Semiconductor Device with Different Fin Pitches
Semiconductor Device with Different Fin Pitches
Patent:
9,589,956 →
Application:
15/172,593 →
Semiconductor Device with Different Fin Pitches
Patent:
9,653,463 →
Application:
15/172,598 →
Forming Insulator Fin Structure in Isolation Region to Support Gate Structures
Copper Interconnect Structures
Patent:
9,806,018 →
Application:
15/186,600 →
Structure and Method for Improved Stabilization of Cobalt Cap and/or Cobalt Liner in Interconnects
Patent:
9,780,035 →
Application:
15/198,721 →
Stacked Nanowire Devices
Multi-Level Metallization Interconnect Structure
Multi-Layer Filled Gate Cut to Prevent Power Rail Shorting to Gate Structure
Patent:
9,805,983 →
Application:
15/241,898 →
Low Aspect Ratio Interconnect
Uniform Fin Dimensions Using Fin Cut Hardmask
Forming a Hybrid Channel Nanosheet Semiconductor Structure
Patent:
9,704,863 →
Application:
15/260,509 →
Method and Structure for Cut Material Selection
Patent:
9,779,944 →
Application:
15/263,959 →
Metal Fill Optimization for Self-Aligned Double Patterning
Patent:
9,735,029 →
Application:
15/273,092 →
Multiple Finfet Formation with Epitaxy Separation
Patent:
9,748,245 →
Application:
15/274,269 →
Transistor with Air Spacer and Self-Aligned Contact
Patent:
9,721,897 →
Application:
15/276,985 →
Margin for Fin Cut Using Self-Aligned Triple Patterning
Transistor with Improved Air Spacer
Preserving Channel Strain in Fin Cuts
Approach to Minimization of Strain Loss in Strained Fin Field Effect Transistors
Patent:
9,818,875 →
Application:
15/295,546 →
Forming a Contact for a Semiconductor Device
Patent:
9,917,060 →
Application:
15/331,331 →
Fin Cut During Replacement Gate Formation
Patent:
9,741,823 →
Application:
15/336,886 →
Stacked Complementary Fets Featuring Vertically Stacked Horizontal Nanowires
Patent:
9,837,414 →
Application:
15/338,515 →
Inner Spacer for Nanosheet Transistors
Patent:
9,923,055 →
Application:
15/339,283 →
Cobalt Contact and Interconnect Structures
Nanosheet Transistors Having Different Gate Dielectric Thicknesses on the Same Chip
Patent:
9,935,014 →
Application:
15/404,469 →
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Patent:
9,935,195 →
Application:
15/404,904 →
Nanosheet Transistors on Bulk Material
Vertical Field Effect Transistors with Metallic Source/Drain Regions
Transistor with Air Spacer and Self-Aligned Contact
Forming Insulator Fin Structure in Isolation Region to Support Gate Structures
Fin Cut During Replacement Gate Formation
Finfet with Uniform Shallow Trench Isolation Recess
Patent:
9,865,598 →
Application:
15/450,725 →
Fully Aligned via with Integrated Air Gaps
Patent:
9,966,337 →
Application:
15/459,684 →
Efficient Metal-Insulator-Metal Capacitor
Forming a Hybrid Channel Nanosheet Semiconductor Structure
Patent:
9,892,976 →
Application:
15/465,962 →
Forming a Hybrid Channel Nanosheet Semiconductor Structure
Patent:
9,881,839 →
Application:
15/465,989 →
Forming Gates with Varying Length Using Sidewall Image Transfer
Forming a Contact for a Semiconductor Device
Transistor with Air Spacer and Self-Aligned Contact
Transistor with Improved Air Spacer
Metal Fill Optimization for Self-Aligned Double Patterning
Fin Cut During Replacement Gate Formation
Multiple Finfet Formation with Epitaxy Separation
Multi-Layer Filled Gate Cut to Prevent Power Rail Shorting to Gate Structure
Self-Aligned Air Gap Spacer for Nanosheet Cmos Devices
Patent:
9,954,058 →
Application:
15/620,437 →
Stacked Nanowire Devices
Integrating and Isolating Nfet and Pfet Nanosheet Transistors on a Substrate
Patent:
10,074,575 →
Application:
15/629,306 →
Structure and Method for Improved Stabilization of Cobalt Cap and/or Cobalt Liner in Interconnects
Copper Interconnect Structures
Forming Insulator Fin Structure in Isolation Region to Support Gate Structures
Forming a Hybrid Channel Nanosheet Semiconductor Structure
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Semiconductor Device with Different Fin Pitches
Nanosheet Transistors on Bulk Material
Patent:
9,917,152 →
Application:
15/701,894 →
Approach to Minimization of Strain Loss in Strained Fin Field Effect Transistors
Cobalt Contact and Interconnect Structures
Efficient Metal-Insulator-Metal Capacitor Fabrication
Self-Aligned Air Gap Spacer for Nanosheet Cmos Devices
Finfet with Uniform Shallow Trench Isolation Recess
Inner Spacer for Nanosheet Transistors
Nanosheet Transistors Having Different Gate Dielectric Thicknesses on the Same Chip
Nanosheet Transistors Having Different Gate Dielectric Thicknesses on the Same Chip
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Forming Gates with Varying Length Using Sidewall Image Transfer
Multi-Level Metallization Interconnect Structure
Margin for Fin Cut Using Self-Aligned Triple Patterning
Forming a Hybrid Channel Nanosheet Semiconductor Structure
Integrating and Isolating Nfet and Pfet Nanosheet Transistors on a Substrate
Nanosheet Transistors on Bulk Material
Preserving Channel Strain in Fin Cuts
Efficient Metal-Insulator-Metal Capacitor
Uniform Fin Dimensions Using Fin Cut Hardmask
Low Aspect Ratio Interconnect
Reduced Resistance Source and Drain Extensions in Vertical Field Effect Transistors
Alternating Hardmasks for Tight-Pitch Line Formation
Efficient Metal-Insulator-Metal Capacitor
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 21, 2016
From: CHENG, KANGGUO; LI, JUNTAO; WANG, GENG; ZHANG, QINTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038339/0230 →
Assignment of Assignor's Interest
Apr 28, 2016
From: MALLELA, HARI V.; ROBISON, ROBERT R.; VEGA, REINALDO; VENIGALLA, RAJASEKHAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038403/0750 →
Assignment of Assignor's Interest
Apr 29, 2016
From: DORIS, BRUCE B.; HOOK, TERENCE B.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038421/0971 →
Assignment of Assignor's Interest
Jun 3, 2016
From: DORIS, BRUCE B.; HOOK, TERENCE B.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038800/0614 →
Assignment of Assignor's Interest
Jun 3, 2016
From: DORIS, BRUCE B.; HOOK, TERENCE B.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038800/0408 →
Assignment of Assignor's Interest
Jun 9, 2016
From: CHENG, KANGGUO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038861/0567 →
Assignment of Assignor's Interest
Jun 20, 2016
From: CLEVENGER, LAWRENCE A.; WANG, WEI; YANG, CHIH-CHAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038953/0169 →
Assignment of Assignor's Interest
Jul 1, 2016
From: BRIGGS, BENJAMIN DAVID; KELLY, JAMES J.; MOTOYAMA, KOICHI; QUON, ROGER ALLAN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039063/0813 →
Assignment of Assignor's Interest
Jul 12, 2016
From: CHENG, KANGGUO; DIVAKARUNI, RAMACHANDRA; LI, JUNTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039134/0660 →
Assignment of Assignor's Interest
Aug 18, 2016
From: ADUSUMILLI, PRANEET; REZNICEK, ALEXANDER; VAN DER STRATEN, OSCAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039478/0251 →
Assignment of Assignor's Interest
Aug 19, 2016
From: CHENG, KANGGUO; TANG, HAO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039487/0208 →
Assignment of Assignor's Interest
Aug 30, 2016
From: BRIGGS, BENJAMIN D.; HUANG, ELBERT E.; PATLOLLA, RAGHUVEER R.; PEETHALA, CORNELIUS BROWN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039588/0592 →
Assignment of Assignor's Interest
Sep 7, 2016
From: CHENG, KANGGUO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039660/0224 →
Assignment of Assignor's Interest
Sep 9, 2016
From: CHENG, KANGGUO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039683/0307 →
Assignment of Assignor's Interest
Sep 13, 2016
From: BURNS, SEAN D.; CLEVENGER, LAWRENCE A.; COLBURN, MATTHEW E.; FELIX, NELSON M.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040019/0688 →
Assignment of Assignor's Interest
Sep 22, 2016
From: CHU, ALBERT M.; CLEVENGER, LAWRENCE A.; GUAN, XIMENG; NA, MYUNG-HEE
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039835/0687 →
Assignment of Assignor's Interest
Sep 23, 2016
From: CHENG, KANGGUO; LI, JUNTAO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039845/0219 →
Assignment of Assignor's Interest
Sep 27, 2016
From: CHENG, KANGGUO; MIAO, XIN; XU, PENG; ZHANG, CHEN
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039864/0126 →
Assignment of Assignor's Interest
Sep 29, 2016
From: KARVE, GAURI; LIE, FEE LI; MILLER, ERIC R.; SIEG, STUART A.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039890/0809 →
Assignment of Assignor's Interest
Oct 5, 2016
From: BI, ZHENXING; CHENG, KANGGUO; LI, JUNTAO; XU, PENG
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039944/0301 →
Assignment of Assignor's Interest
Oct 17, 2016
From: GREENE, ANDREW M.; GUO, DECHAO; RAMACHANDRAN, RAVIKUMAR; VENIGALLA, RAJASEKHAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040029/0335 →
Assignment of Assignor's Interest
Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Assignment of Assignor's Interest
Jan 7, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051493/0546 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0868 →