IP Library Granted Patent US 10,062,615
Granted Patent B2
US 10,062,615 · App. 15/628,821 · Granted Aug 28, 2018

Stacked nanowire devices

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Quick Facts
Patent No.
US 10,062,615
App. No.
15/628,821
Granted
Aug 28, 2018
Kind
B2
Abstract

A semiconductor device comprises first stack of nanowires arranged on a substrate comprises a first nanowire and a second nanowire, the second nanowire is arranged substantially co-planar in a first plane with the first nanowire the first nanowire and the second nanowire arranged substantially parallel with the substrate, a second stack of nanowires comprises a third nanowire and a fourth nanowire, the third nanowire and the fourth nanowire arranged substantially co-planar in the first plane with the first nanowire, and the first nanowire and the second nanowire comprises a first semiconductor material and the third nanowire and the fourth nanowire comprises a second semiconductor material, the first semiconductor material dissimilar from the second semiconductor material.

Claims (24)

1. A semiconductor device comprising:

a first stack of nanowires arranged on a substrate comprising a first nanowire and a second nanowire, the first nanowire and the second nanowire arranged substantially parallel with the substrate;

a second stack of nanowires arranged on the substrate comprising a third nanowire and a fourth nanowire, the third nanowire and the fourth nanowire arranged substantially parallel with the substrate, the third nanowire arranged substantially co-planar in a first plane with the first nanowire, the fourth nanowire arranged substantially co-planar in a second plane with the second nanowire; and

the first nanowire and the second nanowire comprising a first semiconductor material and the third nanowire and the fourth nanowire comprising a second semiconductor material, the first semiconductor material dissimilar from the second semiconductor material.

2. The device of claim 1 , wherein the first semiconductor material includes silicon.

3. The device of claim 1 , wherein the second semiconductor material includes silicon germanium.

4. The device of claim 1 , further comprising a first gate stack arranged over a channel region of the first stack of nanowires.

5. The device of claim 4 , further comprising spacers arranged adjacent to the first gate stack.

6. The device of claim 5 , further comprising a source/drain region arranged adjacent to the spacers.

7. The device of claim 6 wherein the first nanowire extends through the spacer and into the source/drain region.

8. The device of claim 1 , further comprising a second gate stack arranged over a channel region of the second stack of nanowires.

9. The device of claim 8 , further comprising spacers arranged adjacent to the second gate stack.

10. The device of claim 9 , further comprising a source/drain region arranged adjacent to the spacers.

11. A semiconductor device comprising:

a first stack of nanowires arranged on a substrate comprising a first nanowire vertically stacked over a second nanowire;

a second stack of nanowires arranged on the substrate comprising a third nanowire vertically stacked over a fourth nanowire, the third nanowire arranged substantially co-planar in a first plane with the first nanowire, the first plane substantially parallel to a surface of the substrate; and

the first nanowire and the second nanowire comprising a first semiconductor material and the third nanowire and the fourth nanowire comprising a second semiconductor material, the first semiconductor material dissimilar from the second semiconductor material.

12. The device of claim 11 , wherein the first semiconductor material includes silicon.

13. The device of claim 11 , wherein the second semiconductor material includes silicon germanium.

14. The device of claim 11 , further comprising a first gate stack arranged over a channel region of the first nanowire and a channel region of the second nanowire.

15. The device of claim 14 , further comprising spacers arranged adjacent to the first gate stack.

16. The device of claim 15 , further comprising a source/drain region arranged adjacent to the spacers.

17. The device of claim 16 , wherein the first nanowire extends through the spacer and into the source/drain region.

18. The device of claim 14 , further comprising a second gate stack arranged over a channel region of the second stack of nanowires.

Assignments (5)
CHANGE OF NAME Recorded Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0771 →
CHANGE OF NAME Recorded Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0868 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2017
From: CHENG, KANGGUO; DIVAKARUNI, RAMACHANDRA; LI, JUNTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 042769/0350 →