Forming a contact for a semiconductor device
View Patent ↗A method for fabricating a semiconductor device includes forming a gate stack on a semiconductor substrate, forming a source/drain region on an exposed portion of the substrate, and forming a semiconductor material layer on the source/drain region. A first liner layer is deposited on the semiconductor material layer, and a second liner layer is deposited on the first liner layer. A conductive contact material is deposited on the second liner layer.
1. A semiconductor device comprising a PFET and a NFET:
a gate stack arranged over a channel region of a semiconductor substrate;
a spacer arranged adjacent to the gate stack;
a first source and drain region of the PFET arranged adjacent to the spacer,
the first source and drain region comprising:
a first doped crystalline semiconductor material arranged on the semiconductor substrate:
a second doped crystalline semiconductor material arranged on the first doped crystalline semiconductor material;
a first liner layer comprising a conductive metallic oxide material arranged on the second doped crystalline semiconductor material; and
a second liner layer comprising a metallic material arranged on the first liner layer;
a second source and drain region of the NFET arranged adjacent to the spacer the second source and drain region comprising:
a third doped crystalline semiconductor material arranged on the semiconductor substrate; and
the second liner layer formed directly on the third doped crystalline semiconductor material; and
a conductive contact material arranged on the second liner layer in the first source and drain region of the PFET and the second source and drain region of the NFET.
2. The semiconductor device of claim 1 , wherein the first doped crystalline semiconductor material includes crystalline Ge.
3. The semiconductor device of claim 1 , wherein the first source and drain region and the second source and drain region includes doped SiGe material.
4. The semiconductor device of claim 1 , wherein the second liner layer includes Ti.
5. The semiconductor device of claim 1 , wherein the semiconductor substrate includes a semiconductor fin.
6. The semiconductor device of claim 1 , wherein the spacer adjacent to the gate stack is formed prior to forming the first and second source and drain regions.
7. The semiconductor device of claim 1 , wherein an insulator layer is formed over portion of the semiconductor substrate and adjacent to the gate stack prior to forming the first and second source and drain regions.
8. The semiconductor device of claim 1 , wherein the conductive contact material is planarized.
9. The semiconductor device of claim 1 , wherein the semiconductor substrate is selected from the group consisting of Si, strained Si, SiC, Ge, SiGe, SiGeC, Si alloys, Ge alloys, and III-V materials.
10. The semiconductor device of claim 1 , wherein the semiconductor substrate is selected from the group consisting of GaAs, InAs, InP, and AlAs, and II-VI materials.
11. The semiconductor device of claim 1 , wherein the semiconductor substrate is selected from the group consisting of CdSe, CdS, CdTe, ZnO, ZnSe, ZnS, and ZnTe.
12. The semiconductor device of claim 1 , wherein the semiconductor substrate includes material selected from the group consisting of Al, B, Ga, In, N, P, As, and Sb.
13. The semiconductor device of claim 1 , wherein a thickness of the first doped crystalline semiconductor material is about 2 to 40 nm.
14. The semiconductor device of claim 1 , wherein the conductive metallic oxide material is selected from the group consisting of ITO and In2O3.
15. The semiconductor device of claim 1 , wherein the conductive metallic oxide material is selected from the group consisting of Ga2O3, and ZnO.
16. The semiconductor device of claim 1 , wherein the second liner layer includes TiN.
17. The semiconductor device of claim 1 , wherein the conductive contact material is selected from the group consisting of polycrystalline silicon, amorphous silicon, germanium, and silicon germanium.
18. The semiconductor device of claim 1 , wherein the conductive contact material is selected from the group consisting of tungsten, titanium, tantalum, ruthenium, zirconium, cobalt, copper, aluminum, lead, platinum, tin, silver, and gold.