IP Library Granted Patent US 9,735,234
Granted Patent B1
US 9,735,234 · App. 15/207,802 · Granted Aug 15, 2017

Stacked nanowire devices

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Quick Facts
Patent No.
US 9,735,234
App. No.
15/207,802
Granted
Aug 15, 2017
Kind
B1
Abstract

A semiconductor device comprises first stack of nanowires arranged on a substrate comprises a first nanowire and a second nanowire, the second nanowire is arranged substantially co-planar in a first plane with the first nanowire the first nanowire and the second nanowire arranged substantially parallel with the substrate, a second stack of nanowires comprises a third nanowire and a fourth nanowire, the third nanowire and the fourth nanowire arranged substantially co-planar in the first plane with the first nanowire, and the first nanowire and the second nanowire comprises a first semiconductor material and the third nanowire and the fourth nanowire comprises a second semiconductor material, the first semiconductor material dissimilar from the second semiconductor material.

Claims (27)

1. A semiconductor device comprising:

first stack of nanowires arranged on a substrate comprising a first nanowire and a second nanowire, the second nanowire is arranged substantially co-planar in a first plane with the first nanowire the first nanowire and the second nanowire arranged substantially parallel with the substrate,

a second stack of nanowires comprising a third nanowire and a fourth nanowire, the third nanowire and the fourth nanowire arranged substantially co-planar in the first plane with the first nanowire, and

the first nanowire and the second nanowire comprising a first semiconductor material and the third nanowire and the fourth nanowire comprising a second semiconductor material, the first semiconductor material dissimilar from the second semiconductor material.

2. The device of claim 1 , wherein the first nanowire and the second nanowire are substantially co-planar in a second plane, the second plane substantially perpendicular to the first plane.

3. The device of claim 1 , wherein the first semiconductor material includes silicon.

4. The device of claim 1 , wherein the second semiconductor material includes silicon germanium.

5. The device of claim 1 , further comprising a first gate stack arranged over a channel region of the first stack of nanowires.

6. The device of claim 5 , further comprising spacers arranged adjacent to the first gate stack.

7. The device of claim 6 , further comprising a source/drain region arranged adjacent to the spacers.

8. The device of claim 7 wherein the first nanowire extends through the spacer and into the source/drain region.

9. The device of claim 1 , further comprising a second gate stack arranged over a channel region of the second stack of nanowires.

10. The device of claim 9 , further comprising spacers arranged adjacent to the second gate stack.

11. The device of claim 10 , further comprising a source/drain region arranged adjacent to the spacers.

12. A semiconductor device comprising:

first stack of nanowires arranged on a substrate comprising a first nanowire and a second nanowire, the second nanowire is arranged substantially co-planar in a first plane with the first nanowire the first nanowire and the second nanowire arranged substantially parallel with the substrate,

a second stack of nanowires comprising a third nanowire and a fourth nanowire, the third nanowire and the fourth nanowire arranged substantially co-planar in the first plane with the first nanowire,

the first nanowire and the second nanowire comprising a first semiconductor material and the third nanowire and the fourth nanowire comprising a second semiconductor material, the first semiconductor material dissimilar from the second semiconductor material, and

a first gate stack arranged over a channel region of the first nanowire and a channel region of the second nanowire.

13. The device of claim 12 , wherein the first nanowire and the second nanowire are substantially co-planar in a second plane, the second plane substantially perpendicular to the first plane.

14. The device of claim 12 , wherein the first semiconductor material includes silicon.

15. The device of claim 12 , wherein the second semiconductor material includes silicon germanium.

16. The device of claim 12 , further comprising spacers arranged adjacent to the first gate stack.

17. The device of claim 16 , further comprising a source/drain region arranged adjacent to the spacers.

18. The device of claim 17 , wherein the first nanowire extends through the spacer and into the source/drain region.

19. The device of claim 12 , further comprising a second gate stack arranged over a channel region of the second stack of nanowires.

20. The device of claim 19 , further comprising spacers arranged adjacent to the second gate stack.

Assignments (5)
CHANGE OF NAME Recorded Nov 21, 2025
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 073658/0771 →
CHANGE OF NAME Recorded Nov 21, 2025
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 073658/0868 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 12, 2016
From: CHENG, KANGGUO; DIVAKARUNI, RAMACHANDRA; LI, JUNTAO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039134/0660 →