IP Library Assignment 059835/0051
Patent Assignment
Reel/Frame 059835/0051

Change of Name

Recorded: 2022-04-29 Pages: 6
Assignor
TESSERA, INC.
Executed: 2021-10-01
Assignee
TESSERA LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (31)
Iii-V Compound and Germanium Compound Nanowire Suspension with Germanium-Containing Release Layer
Patent: 9,390,980 →
Application: 14/666,520 →
Gate Stack with Tunable Work Function
Patent: 9,583,400 →
Application: 14/996,563 →
Methods of Fabricating Semiconductor Fins by Double Sidewall Image Transfer Patterning Through Localized Oxidation Enhancement of Sacrificial Mandrel Sidewalls
Patent: 9,852,917 →
Application: 15/077,538 →
Publication: US 2017/0278715
Iii-V Compound and Germanium Compound Nanowire Suspension with Germanium-Containing Release Layer
Patent: 9,570,563 →
Application: 15/181,680 →
Publication: US 2016/0284805
Air Gap Spacer Formation for Nano-Scale Semiconductor Devices
Patent: 9,892,961 →
Application: 15/232,341 →
Publication: US 2018/0047615
Gate Cut with Integrated Etch Stop Layer
Application: 15/258,513 →
Publication: US 2018/0069000
Structure and Method to Improve Fav Rie Process Margin and Electromigration
Patent: 9,953,865 →
Application: 15/335,122 →
Publication: US 2018/0114723
Memristive Device Based on Alkali-Doping of Transitional Metal Oxides
Application: 15/405,555 →
Publication: US 2018/0205011
Sacrificial Mandrel Structure with Oxide Pillars having Different Widths and Resulting Fins Arrangements
Application: 15/482,245 →
Publication: US 2017/0278870
Two Dimension Material Fin Sidewall
Patent: 9,947,660 →
Application: 15/489,920 →
Sidewall Image Transfer (SIT) Methods with Localized Oxidation Enhancement of Sacrificial Mandrel Sidewall by Ion Beam Exposure
Application: 15/647,689 →
Publication: US 2017/0316951
Air Gap Spacer Formation for Nano-Scale Semiconductor Devices
Application: 15/789,416 →
Publication: US 2018/0047617
Structure and Process to Tuck Fin Tips Self-Aligned to Gates
Application: 15/794,616 →
Publication: US 2018/0061941
Structure and Process to Tuck Fin Tips Self-Aligned to Gates
Application: 15/794,636 →
Publication: US 2018/0061942
Two Dimension Material Fin Sidewall
Application: 15/799,247 →
Publication: US 2018/0301448
Two Dimension Material Fin Sidewall
Application: 15/799,286 →
Publication: US 2018/0301449
Structure and Method to Improve Fav Rie Process Margin and Electromigration
Application: 15/852,151 →
Publication: US 2018/0122691
Structure and Method to Improve Fav Rie Process Margin and Electromigration
Application: 15/852,176 →
Publication: US 2018/0122692
Two Dimension Material Fin Sidewall
Application: 15/862,976 →
Publication: US 2018/0301450
Low-Resistivity Metallic Interconnect Structures with Self-Forming Diffusion Barrier Layers
Application: 15/870,213 →
Air Gap Spacer Formation for Nano-Scale Semiconductor Devices
Application: 15/977,437 →
Publication: US 2018/0261494
Method of Fabricating Semiconductor Fins by Enhancing Oxidation of Sacrificial Mandrels Sidewalls through Angled Ion Beam Exposure
Application: 16/040,093 →
Publication: US 2018/0323073
Two Dimension Material Fin Sidewall
Application: 16/051,820 →
Publication: US 2018/0342510
Two Dimension Material Fin Sidewall
Application: 16/052,526 →
Publication: US 2018/0342511
Gate Cut with Integrated Etch Stop Layer
Application: 16/054,394 →
Publication: US 2018/0342512
Gate Cut with Integrated Etch Stop Layer
Application: 16/054,417 →
Publication: US 2018/0350810
Gate Cut with Integrated Etch Stop Layer
Application: 16/738,569 →
Publication: US 2020/0152628
Two Dimension Material Fin Sidewall
Application: 16/797,768 →
Publication: US 2020/0219873
Method of Fabricating Semiconductor Fins by Differentially Oxidizing Mandrel Sidewalls
Application: 17/087,185 →
Publication: US 2021/0111032
Structure and Method to Improve Fav Rie Process Margin and Electromigration
Application: 17/212,267 →
Publication: US 2021/0210380
Gate Cut with Integrated Etch Stop Layer
Application: 17/221,401 →
Publication: US 2021/0305247
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 24, 2015
From: COHEN, GUY M.; LAUER, ISAAC; REZNICEK, ALEXANDER; SLEIGHT, JEFFREY W.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 035238/0099 →
Assignment of Assignor's Interest Jan 15, 2016
From: BAO, RUQIANG; KRISHNAN, SIDDARTH A.; KWON, UNOH; NARAYANAN, VIJAY
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 037501/0364 →
Assignment of Assignor's Interest Mar 22, 2016
From: CHENG, KANGGUO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038072/0185 →
Assignment of Assignor's Interest Jun 14, 2016
From: COHEN, GUY M.; LAUER, ISAAC; REZNICEK, ALEXANDER; SLEIGHT, JEFFREY W.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038907/0565 →
Assignment of Assignor's Interest Aug 9, 2016
From: CHENG, KANGGUO; HAIGH, THOMAS J.; LI, JUNTAO; LINIGER, ERIC G.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039636/0186 →
Assignment of Assignor's Interest Sep 7, 2016
From: BERGENDAHL, MARC A.; GREENE, ANDREW M.; VENIGALLA, RAJASEKHAR
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 039661/0441 →
Assignment of Assignor's Interest Oct 28, 2016
From: BRIGGS, BENJAMIN DAVID; LEE, JOE; STANDAERT, THEODORUS EDUARDUS
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040161/0439 →
Assignment of Assignor's Interest Jan 13, 2017
From: BREW, KEVIN W.; GERSHON, TALIA S.; NEWNS, DENNIS M.; SINGH, SAURABH
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 040984/0873 →
Assignment of Assignor's Interest Apr 7, 2017
From: CHENG, KANGGUO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 041932/0741 →
Assignment of Assignor's Interest Apr 18, 2017
From: ROSENBLATT, SAMI; TOPALOGLU, RASIT O.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 042040/0886 →
Assignment of Assignor's Interest Jul 12, 2017
From: CHENG, KANGGUO
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 042987/0228 →
Assignment of Assignor's Interest Oct 20, 2017
From: CHENG, KANGGUO; HAIGH, THOMAS J.; LI, JUNTAO; LINIGER, ERIC G.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044255/0392 →
Assignment of Assignor's Interest Oct 26, 2017
From: DORIS, BRUCE B.; HE, HONG; KANAKASABAPATHY, SIVANANDA K.; KARVE, GAURI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 043960/0598 →
Assignment of Assignor's Interest Oct 26, 2017
From: DORIS, BRUCE B.; HE, HONG; KANAKASABAPATHY, SIVANANDA K.; KARVE, GAURI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 043960/0479 →
Assignment of Assignor's Interest Oct 31, 2017
From: ROSENBLATT, SAMI; TOPALOGLU, RASIT O.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 043995/0260 →
Assignment of Assignor's Interest Oct 31, 2017
From: ROSENBLATT, SAMI; TOPALOGLU, RASIT O.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 043995/0032 →
Corrective Assignment to Correct the Add Omitted Inventors Name Previously Recorded at Reel: 043960 Frame: 0479. Assignor(S) Hereby Confirms the Assignment . Nov 13, 2017
From: DORIS, BRUCE B.; HE, HONG; KANAKASABAPATHY, SIVANANDA K.; KARVE, GAURI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044427/0797 →
Corrective Assignment to Correct the Add Omitted Inventors Name Previously Recorded at Reel: 043960 Frame: 0598. Assignor(S) Hereby Confirms the Assignment . Nov 13, 2017
From: DORIS, BRUCE B.; HE, HONG; KANAKASABAPATHY, SIVANANDA K.; KARVE, GAURI
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044427/0691 →
Assignment of Assignor's Interest Dec 29, 2017
From: BRIGGS, BENJAMIN DAVID; LEE, JOE; STANDAERT, THEODORUS EDUARDUS
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044985/0142 →
Assignment of Assignor's Interest Dec 29, 2017
From: BRIGGS, BENJAMIN DAVID; LEE, JOE; STANDAERT, THEODORUS EDUARDUS
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 044985/0152 →
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
Assignment of Assignor's Interest Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0324 →
Assignment of Assignor's Interest Jan 7, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051493/0546 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Corrective Assignment to Correct the 16/161,111 Previously Recorded on Reel 051489 Frame 0324. Assignor(S) Hereby Confirms the Assignment. Aug 3, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 053389/0252 →