IP Library Granted Patent US 9,570,563
Granted Patent B2
US 9,570,563 · App. 15/181,680 · Granted Feb 14, 2017

III-V compound and Germanium compound nanowire suspension with Germanium-containing release layer

Inventors: Guy M. Cohen (Ossining, NY); Isaac Lauer (Yorktown Heights, NY); Alexander Reznicek (Troy, NY); Jeffrey W. Sleight (Ridgefield, CT)
Assignee: International Business Machines Corporation
H01L29/413H01L21/823807H01L27/092H01L29/0673H01L29/41758H01L29/4966H01L29/775
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Quick Facts
Patent No.
US 9,570,563
App. No.
15/181,680
Granted
Feb 14, 2017
Kind
B2
Abstract

A device that includes: a substrate layer; a first set of source/drain component(s) defining an nFET (n-type field-effect transistor) region; a second set of source/drain component(s) defining a pFET (p-type field-effect transistor) region; a first suspended nanowire, at least partially suspended over the substrate layer in the nFET region and made from III-V material; and a second suspended nanowire, at least partially suspended over the substrate layer in the pFET region and made from Germanium-containing material. In some embodiments, the first suspended nanowire and the second suspended nanowire are fabricated by adding appropriate nanowire layers on top of a Germanium-containing release layer, and then removing the Germanium-containing release layers so that the nanowires are suspended.

Claims (6)

1. A semiconductor device comprising:

a substrate layer;

a first set of source/drain component(s) defining an nFET (n-type field-effect transistor) region in the substrate layer;

a second set of source/drain component(s) defining a pFET (p-type field-effect transistor) region in the substrate layer;

a first suspended nanowire, at least partially suspended over the substrate layer in the nFET region, made from III-V material, and electrically connected to act as a gate for the first set of source/drain component(s); and

a second suspended nanowire, at least partially suspended over the substrate layer in the pFET region, made from Silicon-Germanium (SiGe), and electrically connected to act as a gate for the second set of source/drain component(s).

Assignments (5)
CHANGE OF NAME Recorded Sep 27, 2024
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 069067/0454 →
CHANGE OF NAME Recorded Apr 29, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 059835/0051 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: TESSERA, INC.
Reel/Frame 051489/0557 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2016
From: COHEN, GUY M.; LAUER, ISAAC; REZNICEK, ALEXANDER; SLEIGHT, JEFFREY W.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 038907/0565 →
Continuity (2)
Division 14666520 · Mar 24, 2015
Related Publication 20160284805A1 · Sep 29, 2016