IP Library Assignment 031169/0620
Patent Assignment
Reel/Frame 031169/0620

Assignment of Assignor's Interest

Recorded: 2013-08-14 Pages: 6
Assignor
TESSERA RESEARCH LLC
Executed: 2011-09-08
Assignee
TESSERA, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property (1)
High Density Three-Dimensional Integrated Capacitors
Patent: 9,431,475 →
Application: 13/954,455 →
Publication: US 2013/0313680
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 12, 2013
From: OGANESIAN, VAGE; HABA, BELGACEM; MOHAMMED, ILYAS; SAVALIA, PIYUSH
To: TESSERA RESEARCH LLC
Reel/Frame 031096/0654 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Certificate of Conversion & Change of Name Jun 27, 2022
From: TESSERA, INC.
To: TESSERA LLC
Reel/Frame 060443/0792 →
Change of Name Sep 13, 2023
From: TESSERA LLC
To: ADEIA SEMICONDUCTOR SOLUTIONS LLC
Reel/Frame 064897/0184 →