IP Library › Assignment 035734/0284
Patent Assignment
Reel/Frame 035734/0284

Assignment of Assignor's Interest

Recorded: 2015-05-28 Pages: 3
Assignor
LI, SHIDONG
Executed: 2015-05-26
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Limiting Electronic Package Warpage with Semiconductor Chip Lid and Lid-Ring
Patent: 9,892,935 →
Application: 14/724,097 →
Publication: US 2016/0351467
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2020
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: ELPIS TECHNOLOGIES INC.
Reel/Frame 052561/0161 →