IP Library › Assignment 035752/0550
Patent Assignment
Reel/Frame 035752/0550

Assignment of Assignor's Interest

Recorded: 2015-06-01 Pages: 4
Assignor
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Properties (2)
Substrate Carrier System Utilizing Electrostatic Chucking to Accommodate Substrate Size Heterogeneity
Patent: 9,845,533 →
Application: 14/538,769 →
Publication: US 2016/0133782
Apparatus for High Compressive Stress Film Deposition to Improve Kit Life
Application: 62/063,926 →
Related Assignments (4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 29, 2014
From: WEI, JUNQI; SAVANDAIAH, KIRANKUMAR; JUPUDI, ANANTHKRISHNA; CAO, ZHITAO
To: APPLIED MATERIALS, INC.
Reel/Frame 034061/0316 →
Assignment of Assignor's Interest Jan 20, 2015
From: OW, YUEH SHENG
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 034756/0807 →
Assignment of Assignor's Interest Jan 29, 2015
From: ELUMALAI, KARTHIK; ZHU, MINGWEI
To: APPLIED MATERIALS, INC.
Reel/Frame 034846/0249 →
Assignment of Assignor's Interest Jan 29, 2015
From: THIRUNAVUKARASU, SRISKANTHARAJAH; LEW, JEN SERN
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 034846/0754 →