IP Library › Assignment 035789/0898
Patent Assignment
Reel/Frame 035789/0898

Assignment of Assignor's Interest

Recorded: 2015-06-04 Pages: 9
Assignors
KIM, KEUN SOO
Executed: 2015-04-13
KIM, JAE YUN
Executed: 2015-04-17
AHN, BYOUNG JUN
Executed: 2015-05-27
RYU, DONG SOO
Executed: 2015-04-15
KANG, DAE BYOUNG
Executed: 2015-04-09
PARK, CHEL WOO
Executed: 2015-04-15
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package and Fabricating Method Thereof
Patent: 9,859,203 →
Application: 14/694,269 →
Publication: US 2016/0225692
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →