IP Library › Assignment 035798/0084
Patent Assignment
Reel/Frame 035798/0084

Assignment of Assignor's Interest

Recorded: 2015-05-29 Pages: 5
Assignors
PAEK, JONG SIK
Executed: 2015-04-06
PARK, DOO HYUN
Executed: 2015-04-06
LEE, WANG GU
Executed: 2015-04-06
SONG, YONG
Executed: 2015-04-06
KANG, SUNG GEUN
Executed: 2015-04-06
Assignee
AMKOR TECHNOLOGY, INC.
2045 E. INNOVATION CIRCLE, TEMPE, ARIZONA, 85284
Covered Property (1)
Semiconductor Package with Semiconductor Die Directly Attached to Lead Frame and Method
Patent: 9,711,484 →
Application: 14/725,156 →
Publication: US 2016/0141229
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →