Patent Assignment
Reel/Frame 035823/0072
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 2
Assignors
HSU, WEN-SUNG
Executed: 2015-06-01
LIN, SHIH-CHIN
Executed: 2015-06-01
CHANG, ANDREW C.
Executed: 2015-06-01
CHENG, TAO
Executed: 2015-06-01
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Structure and Formation Method of Chip Package Structure