Patent Assignment
Reel/Frame 035824/0471
Assignment of Assignor's Interest
Recorded: 2015-06-11
Pages: 4
Assignors
YIU, HO-YIN
Executed: 2015-05-20
WEN, YING-NAN
Executed: 2015-05-20
LIU, CHIEN-HUNG
Executed: 2015-05-20
YANG, WEI-CHUNG
Executed: 2015-05-20
Assignee
XINTEC INC.
9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK, JHONGLI DIST., TAOYUAN CITY, 32062, TAIWAN
Covered Property
(1)
Chip Package and Method for Forming the Same