Patent Assignment
Reel/Frame 035869/0026
Assignment of Assignor's Interest
Recorded: 2015-06-19
Pages: 4
Assignors
CHENG, CHENG-WEI
Executed: 2015-04-23
SADANA, DEVENDRA K.
Executed: 2015-04-24
SHIU, KUEN-TING
Executed: 2015-04-23
SUN, YANNING
Executed: 2015-04-23
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Preparation of Low Defect Density of Iii-V on Si for Device Fabrication
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.