Patent Assignment
Reel/Frame 035901/0621
Assignment of Assignor's Interest
Recorded: 2015-06-24
Pages: 4
Assignors
STUBER, MICHAEL A.
Executed: 2012-12-20
MOLIN, STUART B
Executed: 2012-12-20
DRUCKER, MARK
Executed: 2012-12-20
FOWLER, PETER
Executed: 2012-12-20
Assignee
IO SEMICONDUCTOR INCORPORATED
4350 EXECUTIVE DRIVE, SUITE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Thin Integrated Circuit Chip-on-Board Assembly
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 24, 2015
From: IO SEMICONDUCTOR INCORPORATED
To: SILANNA SEMICONDUCTOR U.S.A., INC.
Reel/Frame 036012/0161 →
Corrective Assignment to Correct the Assignee Name Previously Recorded at Reel: 035901 Frame: 0621. Assignor(S) Hereby Confirms the Assignment.
Jul 20, 2015
From: STUBER, MICHAEL A.; MOLIN, STUART B.; DRUCKER, MARK; FOWLER, PETER
To: IO SEMICONDUCTOR INCORPORATED
Reel/Frame 036138/0935 →
Change of Name
Oct 16, 2015
From: SILANNA SEMICONDUCTOR U.S.A., INC.
To: QUALCOMM SWITCH CORP.
Reel/Frame 036877/0140 →
Assignment of Assignor's Interest
May 23, 2016
From: QUALCOMM SWITCH CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 038794/0663 →