Patent Assignment
Reel/Frame 035917/0255
Assignment of Assignor's Interest
Recorded: 2015-06-26
Pages: 3
Assignors
FAROOQ, MUKTA G
Executed: 2015-06-25
MARTIN, ANDREW J.
Executed: 2015-06-25
OAKLEY, JENNIFER A.
Executed: 2015-06-25
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Integrated Circuit (Ic) Chips with Through Silicon Vias (Tsv) and Method of Forming the Ic
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jan 3, 2016
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: GLOBALFOUNDRIES U.S. 2 LLC
Reel/Frame 037409/0869 →
Assignment of Assignor's Interest
Jan 15, 2016
From: GLOBALFOUNDRIES U.S. 2 LLC; GLOBALFOUNDRIES U.S. INC.
To: GLOBALFOUNDRIES INC.
Reel/Frame 037542/0087 →
Security Agreement
Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest
Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest
May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →