Patent Assignment
Reel/Frame 035992/0900
Assignment of Assignor's Interest
Recorded: 2015-07-06
Pages: 4
Assignors
TSUJI, KENICHI
Executed: 2015-06-05
YAMADA, KUNIHIRO
Executed: 2015-06-05
KIZAKI, HIROAKI
Executed: 2015-06-05
MATSUMOTO, NOBUAKI
Executed: 2015-06-05
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Heat Conductive Silicone Composition Based on Combination of Components, Heat Conductive Layer, and Semiconductor Device