Heat conductive silicone composition based on combination of components, heat conductive layer, and semiconductor device

1. A heat conductive silicone composition to be disposed between a heat generating electronic part and a heat dissipating member, the heat conductive silicone composition comprising the following components (A) to (F)

(A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a kinetic viscosity of 10 to 100,000 mm 2 /s at 25° C.,

(B) 50 to 150 parts by weight of a hydrolyzable dimethylpolysiloxane having tri-functionality at one end, represented by the general formula (1):

wherein a is a positive number of 5 to 100 and R′ is an alkyl group of 1 to 6 carbon atoms,

(C) a heat conductive filler having a thermal conductivity of at least 10 W/m° C., in an amount of 800 to 2,000 parts by weight per 100 parts by weight of components (A) and (B) combined,

(D) an organohydrogenpolysiloxane represented by the general formula (2):

wherein b is a positive number of 5 to 500 and R 2 is an alkyl group of 1 to 6 carbon atoms,

(E) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule other than component (D),

components (D) and (E) being blended in such amounts that the ratio of the number of Si—H groups in components (D) and (E) combined to the number of alkenyl groups in component (A) may range from 0.5 to 2.0, and the ratio of the number of Si—H groups in component (D) to the number of Si—H groups in component (E) may range from 0.6 to 10.0, and

(F) a catalyst selected from the group consisting of platinum and platinum compounds in such an amount as to provide 0.1 to 500 ppm of platinum atom based on component (A),

wherein said silicone heat conductive composition cures into a product having a storage modulus G′ of 2,000 Pa to 20,000 Pa, a loss modulus G″ of 5,000 Pa to 40,000 Pa, and a loss factor tan δ of 0.8 to 3.0, at 150° C., and wherein said silicone composition cures at 150° C. into a product having a thermal resistance of 3 to 11 mm 2 ·K/W.

2. The heat conductive silicone composition of claim 1 , further comprising (G) an inhibitor for inhibiting the catalytic activity of component (F), selected from the group consisting of acetylene compounds, nitrogen compounds, organophosphorus compounds, oxime compounds and organic chlorine compounds, in an amount of 0.1 to 5% by weight based on component (A).

3. A heat conductive layer disposed between a heat generating electronic part and a heat dissipating member for conducting the heat from the heat generating electronic part to the heat dissipating member, said heat conductive layer being formed by curing the heat conductive silicone composition of claim 1 .

4. A semiconductor device comprising a heat generating electronic part, a heat dissipating member, and a heat conductive layer which is a cured product of the heat conductive silicone composition of claim 1 , wherein the heat generating electronic part is bonded to the heat dissipating member through the heat conductive layer.

5. The semiconductor device of claim 4 wherein said heat conductive layer has a thickness of up to 200 μm.

6. The semiconductor device of claim 4 , wherein said heat generating electronic part is a semiconductor element having a chip area of at least 50 mm 2 .

7. The heat conductive silicone composition of claim 1 , which cures into a product having a thermal conductivity of 0.1 to 20 W/mK.

8. The heat conductive silicone composition of claim 1 , which is a grease-like material having a viscosity of 10 to 500 Pa·s.

9. A heat conductive silicone composition comprising the following components (A) to (F)

(A) 100 parts by weight of an organopolysiloxane containing at least two alkenyl groups per molecule and having a kinetic viscosity of 10 to 100,000 mm 2 /s at 25° C.,

(B) 50 to 150 parts by weight of a hydrolyzable dimethylpolysiloxane having tri-functionality at one end, represented by the general formula (1):

wherein a is a positive number of 5 to 100 and R 1 is an alkyl group of 1 to 6 carbon atoms,

(C) a heat conductive filler having a thermal conductivity of at least 10 W/m° C., in an amount of 800 to 2,000 parts by weight per 100 parts by weight of components (A) and (B) combined,

(D) an organohydrogenpolysiloxane represented by the general formula (2):

wherein b is a positive number of 5 to 500 and R 2 is an alkyl group of 1 to 6 carbon atoms,

(E) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule other than component (D),

components (D) and (E) being blended in such amounts that the ratio of the number of Si—H groups in components (D) and (E) combined to the number of alkenyl groups in component (A) may range from 0.5 to 2.0, and the ratio of the number of Si—H groups in component (D) to the number of Si—H groups in component (E) may range from 0.6 to 10.0, and

(F) a catalyst selected from the group consisting of platinum and platinum compounds in such an amount as to provide 0.1 to 500 ppm of platinum atom based on component (A),

wherein said heat conductive silicone composition cures into a product having a storage modulus G′ of 2,000 Pa to 20,000 Pa, a loss modulus G″ of 5,000 Pa to 40,000 Pa, and a loss factor tan δof 0.8 to 3.0, at 150° C., and wherein said silicone composition cures at 150° C. into a product having a thermal resistance of 3 to 11 mm 2 ·K/W, and

wherein, when the composition is coated to a substrate and cured into a product, the cured product has a thermal resistance value α, and when the cured product is subjected to cohesive failure or interfacial peeling from the substrate and tightly adhered to the substrate again, the cured product has a thermal resistance value β, and the ratio β/α is up to 1.1.