Patent Assignment
Reel/Frame 036002/0596
Assignment of Assignor's Interest
Recorded: 2015-07-06
Pages: 5
Assignors
PARK, SOOSAN
Executed: 2015-06-26
KIM, KYUSANG
Executed: 2015-06-26
KO, YEOCHAN
Executed: 2015-07-04
LEE, KEOCHANG
Executed: 2015-06-26
CHI, HEEJO
Executed: 2015-06-26
LEE, HEESOO
Executed: 2015-07-03
Assignee
STATS CHIPPAC LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Integrated Circuit Packaging System with Interposer Support Structure Mechanism and Method of Manufacture Thereof
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.