Patent Assignment
Reel/Frame 036002/0724
Assignment of Assignor's Interest
Recorded: 2015-07-06
Pages: 6
Assignors
LIN, YAOJIAN
Executed: 2015-03-16
CHOI, WON KYOUNG
Executed: 2015-03-16
CHEN, KANG
Executed: 2015-03-16
MICALLEF, IVAN
Executed: 2015-07-03
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming Microelectromechanical Systems (MEMS) Package