Patent Assignment
Reel/Frame 036052/0471
Assignment of Assignor's Interest
Recorded: 2015-07-02
Pages: 6
Assignors
WANG, XINXIN
Executed: 2015-06-15
JIANG, XUCHU
Executed: 2015-06-15
XU, TAO
Executed: 2015-06-15
ZHU, WENJING
Executed: 2015-06-15
SUN, FANGXIONG
Executed: 2015-06-15
SUN, JUN
Executed: 2015-06-15
Assignee
SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD
1525 ZHANGDONG ROAD, PUDONG NEW AREA, SHANGHAI, 201203, CHINA
Covered Property
(1)
Warped Silicon-Chip Adsorption Device and Adsorption Method Thereof
Application:
14/655,465 →
Publication:
US 2015/0357217
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Jun 30, 2017
From: SHANGHAI MICRO ELECTRONICS EQUIPMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 043517/0989 →
Corrective Assignment to Correct the Application Serial Number Previously Recorded at Reel: 043517 Frame: 0989. Assignor(S) Hereby Confirms the Assignment.
Mar 29, 2019
From: SHANGHAI MICRO ELECTRONICS EQUPIMENT CO., LTD.
To: SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
Reel/Frame 048745/0860 →