IP Library › Assignment 036104/0397
Patent Assignment
Reel/Frame 036104/0397

Assignment of Assignor's Interest

Recorded: 2015-07-16 Pages: 12
Assignors
LIN, SHIH-CHIN
Executed: 2015-05-11
HUNG, KUEI-CHUN
Executed: 2015-05-11
HU, JERRY CHE JEN
Executed: 2015-05-07
CHEN, MING-JUI
Executed: 2015-05-07
HSU, CHEN-HSIEN
Executed: 2015-05-08
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Integrated Finfet Structure Having a Contact Plug Pitch Larger Than Fin and First Metal Pitch
Patent: 9,653,346 →
Application: 14/800,697 →
Publication: US 2016/0329241