IP Library Assignment 036105/0235
Patent Assignment
Reel/Frame 036105/0235

Assignment of Assignor's Interest

Recorded: 2015-07-15 Pages: 3
Assignors
HAN, SIN SEOK
Executed: 2015-06-29
CHOI, SOO YOUNG
Executed: 2015-06-30
NAM, KI MYUNG
Executed: 2015-06-29
Assignee
ABM CO., LTD.
89, ASAN VALLEY-RO, DUNPO-MYEON, CHUNGCHEONGNAM-DO, ASAN-SI, 336-875, KOREA, REPUBLIC OF
Covered Property (1)
Chip Substrate Comprising a Groove Portion and Chip Package Using the Chip Substrate
Patent: 9,653,664 →
Application: 14/753,915 →
Publication: US 2016/0380168
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 21, 2016
From: ABM CO., INC.
To: POINT ENGINEERING CO., LTD.
Reel/Frame 039809/0781 →